Obvod: W25Q80DV [WSON8]
Výrobca: Winbond
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| W | Winbond | |
| XXX | Family Descriptor | 25P = spiFlash serial flash memory 25Q = spiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O 25X, 25D = spiFlash serial flash memory with 4kB sectors, dual outputs 25B = spiFlash serial flash memory with boot and parameter sectors |
| XXX | Density | 10, 10A, 10B, 10C, 10R = 1Mbit 20, 20A, 20B, 20C, 20R, 21E = 2Mbit 40, 40A, 40B, 40C, 40R = 4Mbit 80, 80A, 80B, 80D, 81D = 8Mbit 16, 16A, 16B, 16C, 16D, 16J = 16Mbit 32, 32A, 32B, 32D, 32F = 32Mbit 64, 64B, 64C, 64D, 64F = 64Mbit 128B, 128F, 12P = 128Mbit 256F, 257F = 256Mbit 512J = 512Mbit 01J = 1Gbit 02J = 2Gbit |
| X | Supply Voltage | L = 2.3V to 3.3V V = 2.7V to 3.6V W = 1.65V to 1.95V |
| XX | Package Type | DA = PDIP8 300mil SN = SOIC8 150mil SS = SOIC8 200mil SF = SOIC16 300mil ZP = WSON8 6x5mm ZE = WSON8 8x6mm UU = USON8 4x3mm UX = 8-pad USON 2x3mm B = TFBGA24 8x6mm (5x5 ball array) (W25Q128FV) C = TFBGA24 8x6mm (6x4 ball array) (W25Q128/256FV) E = WSON8 8x6mm (W25Q128/256FV) F = SOIC16 300mil (W25Q128/256FV) P = WSON8 6x5mm (W25Q128FV) S = SOIC8 200mil (W25Q128FV) SV = VSOP8 150mil ST, T = VSOP8 208mil TB = 24-ball TFBGA 8x6mm (5x5-1 ball array) TC = 24-ball TFBGA 8x6mm (6x4 ball array) BY = 8-ball WLCSP XH = 8-pad XSON 2x3 |
| X | Temperature Range | C = Commercial (0°C to 70°C) I = Industrial (-40°C to 85°C) A = Automotive Grade 2 (-40°C to +105°C) J = Industrial Plus (-40°C to +105°C) S |
| X | Special Options | Blank = Standard G = Green package (Lead-free, RoHS compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb203) Z = Lead free (Lead-free, RoHS compliant) 1 = One time program (OTP) enabled P = Green Package with Status Register Power-Down & OTP enabled Q = Green Package with QE=1 in Status Register-2 M = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free SB2O3) & optimized for mobile applications N = Green Package with QE=1 in Status register-2 & DRV=75\\\\% E = Green Package with Extended Pad F = Green Package with QE=0 in Status Register-2 & SFDP |
| XXX | Transfer Rate | Blank = Single transfer rate DTR = Double transfer rate |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
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