Obvod: S71WS256PC0HF3T [FBGA84]
Výrobca: Spansion
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| S | Spansion Memory | |
| XX | Product Series | 71 = Multi-chip product (MCP) 73 = Stacked products (MCP) 98 = Stacked Multi-chip product |
| X | Flash Interface And Simultaneous Read-Write | J = Standard, simultaneous read-write A = Standard, no simultaneous read-write P = Page, simultaneous read-write G = Page, no simultaneous read-write W = Burst (Demux add/data), simultaneous read-write R = Burst (Demux add/data), no simultaneous read-write N = Burst (Mux add/data), simultaneous read-write K = Burst (Mux add/data), no simultaneous read-write C = Automotive burst (Demux), simultaneous read-write V = Simultaneous Read/Write, Burst mode with multiplexed I/O |
| X | Core Voltage | F = 5.0 V Vcc L = 3.0 V Vcc D = 2.5 V Vcc S = 1.8V Vcc |
| XXX | Density | 001-999 = 1Mb - 999Mb 01G-64G = 1Gb - 64Gb |
| X | Process Technology | B = 320 nm, Floating gate technology C = 320 nm, Floating gate technology D = 200 nm, Floating gate technology G = 170 nm, Floating gate technology H = 130 nm, Floating gate technology J = 110 nm, Floating gate technology M = 230 nm, MirrorBit technology A = 200 nm MirrorBit technology N = 110 nm, MirrorBit technology P = 90 nm, MirrorBit technology K = 90 nm, Floating gate technology R = 65 nm, MirrorBit technology |
| XX | pSRAM Density | 04 = 4Mbit SRAM 08 = 8Mbit SRAM 0A = 16Mbit pSRAM 40 = 4Mbit pSRAM 80 = 8Mbit pSRAM A0 = 16Mbit pSRAM B0 = 32Mbit pSRAM C0 = 64Mbit pSRAM D0 = 128Mbit pSRAM |
| XX | Package Type | B = FBGA C = CSOP (Lead Frame) D = Die (Die/Wafer) E = Super CSP (BGA) F = Fortified BGA M = SOIC/SOP (Lead Frame) N = WSON (Lead Frame) T = TSOP S = SOP H = MCP FBGA K = POP FBGA J = MCP FBGA ZJ = Very thin fine-pitch BGA lead-free LF35 package |
| X | Package Material Set | Blank A = Standard, not lead (Pb)-free F = Standard, lead (PB)-free |
| X | Temperature Range | Blank E = Engineering samples C = Commercial (0°C to 70°C) W = Wireless (-25°C to 85°C) I = Industrial (-40°C to 85°C) N = Extended (-40°C to 125°C) |
| X | Package Modifier | Blank 0, Q = 7x9mm, 1.2mm height, 56 balls 9 = 8x11.6mm, 1.2mm height, 64 balls T = 8x11.6mm, 1.4mm height, 84 balls A = 8x11.6mm, 1.2mm height, 84 balls E = 9x12mm, 1.2mm height, 84 balls Y = 9x12mm, 1.2mm height, 84 balls K = 7.7x6.2mm, 56-Ball |
| X | Model Number 1 | Blank H = CellularRAM type 2, DYB=1, PPB=0 S = CellularRAM type 2, DYB=1, PPB=1 T = CellularRAM type 3, DYB=1, PPB=1 4 = SDR DRAM x16, Type 5 |
| X | Model Number 2 | Blank V = 66MHz flash speed R = 80Mhz flash speed L = 108MHz flash speed |
| X | Packing Type | 0Tray 1 = Tube 2 = 7\\\'\\\' Tape & Reel 3 = 13\'\' Tape & Reel |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: BGA-0812/0446 (70-0812/0446) = BGA-Bottom-94 (70-0812) + BGA-Top-48 ZIF (70-0446) |
| BeeHive204AP | adaptér/modul: AP1 BGA-0812/0446 (71-2112) |
| BeeHive208S | adaptér/modul: BGA-0812/0446 (70-0812/0446) = BGA-Bottom-94 (70-0812) + BGA-Top-48 ZIF (70-0446) |
| BeeProg2 | adaptér/modul: BGA-0812/0446 (70-0812/0446) = BGA-Bottom-94 (70-0812) + BGA-Top-48 ZIF (70-0446) |
| BeeProg2AP | adaptér/modul: AP1 BGA-0812/0446 (71-2112) |
| BeeProg2C | adaptér/modul: BGA-0812/0446 (70-0812/0446) = BGA-Bottom-94 (70-0812) + BGA-Top-48 ZIF (70-0446) |
| BeeHive204AP-AU (prestala byť podporovaná) | adaptér/modul: AP1 BGA-0812/0446 (71-2112) |
