Obvod: S3F84T5 [SOP32]
Výrobca: Samsung
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| S | System LSI | |
| 3 | Microcontroller | |
| X | Family Type | C = Mask ROM F = FLASH 3 = MCP E = EVA-CHIP P = OTP |
| X | Core | 1 = 51 4-bit 2 = 32-bit ARM9 3 = 17 16-bit 4 = 32 32-bit 5 = 32-bit ARM10 6 = 56 4-bit 7 = 57 4-bit 8 = 88 8-bit 9 = 86 8-bit A = 15 Other B = 8-bit CALM RISC MAC C = 16-bit CALM RISC MAC D = 32-bit CALM RISC MAC I = Custom MCU J = SC-200 K = 8-bit CALM RISC L = 16-bit CALM RISC R = 128-bit CALM RISC S = SC-100 |
| XX | Application Category | 0n = General Purpose 1n = Voice 2n = LCD 3n = Audio 4n = General A/D 5n = Telecom 6n = PC & Peripherial, OA 7n = VFD 8n = Video 9n = Special (IC Card) An = General Purpose-1 Cn = C Fn = Telecom-1 Nn = Intel Application Zn = Assigment Code "n" Serial No. (1~Z) |
| X | ROM Master | 0ROMless 1 = 1kx8 2 = 2kx8 3 = 12kx8 4 = 4kx8 5 = 16kx8 6 = 6kx8 7 = 24kx8 8 = 8kx8 9 = 32kx8 A = 48kx8 B = 64kx8 C = 96kx8 D = 128kx8 F = 256kx8 G = 384kx8 H = 512kx8 J = 768kx8 K = 1Mx8 W = 144kx8 |
| X | Version | |
| XX | Mask Option | |
| XX | Package Type | A = SDIP B = LGA C = Chip BIZ D = DIP E = LQFP F = WQFP G = BGA H = CSP J = BQFP K = UELP L = ELP M = QFPH N = COB P = PLCC R = TSSOP Q = QFP S = SOP T = TQFP V = SSOP W = Waffer Y = FBGA Z = SBGA |
| X | Package Pin | SDIP package: B=56, M=24, O=32, Q=42, T=64, V=30 LGA package: A=88, C=83, J=176 DIP package: C=8, H=16, I=18, K=20, N=28, P=40 LQFP package: C=144, D=160, E=208, G=256, J=176, R=48, T=64, W=80, X=100 WQFP package: T=64 BGA package: A=272, B=416, C=496, D=153 CSP package: J=176 BQFP package: B=132 UELP package: T=64 ELP package: R=48, T=64 QFPH package: D=160, F=240 COB package: C=8, D=8CNCL PLCC package: C=52, Z=44 TSSOP package: R=48 QFP package: A=128, C=144, D=160, E=208, G=256, R=48, T=64, U=304, W=80, X=100, Z=44 SOP package: C=8, H=16, I=18, K=20, M=24, N=28, O=32 TQFP package: A=128, T=64, W=80, X=100 TEBGA package: X=492 FBGA package: A=337, B=81, C=144, D=160, E=208, F=180, G=285, H=320, K=105, L=400, O=272, P=504, Q=289, T=64, U=83, X=100 SBGA package: A=432 SSOP package: H=16, K=20 |
| X | Packing | B = Tube U = Bulk R = Tray T = Tape & Reel S = Tape & Reel reverse C = Chip Biz D = Chip Biz (3 inch tray) E = Chip Biz (4 inch tray) F = Chip Biz (reverse) W = WF Biz Draft Wafer X = WF Biz Full Cutting 7 = Tape & Reel (Pb-Free PKG) 8 = Tray (Pb-Free PKG) 9 = Tube (Pb-Free PKG) |
| X | ROM Size | 0ROMless 1 = 1kx8 2 = 2kx8 3 = 12kx8 4 = 4kx8 5 = 16kx8 6 = 6kx8 7 = 24kx8 8 = 8kx8 9 = 32kx8 A = 48kx8 B = 64kx8 C = 96kx8 D = 128kx8 E = Extended F = 256kx8 G = 384kx8 H = 512kx8 J = 768kx8 K = 1Mx8 M = Military N = Industrial W = 144kx8 X = Special MK3 Y = Special MK2 Z = Special MK1 |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: DIL32/SOIC32 ZIF-CS 330mil (70-3331) |
| BeeHive208S | adaptér/modul: DIL32/SOIC32 ZIF-CS 330mil (70-3331) |
| BeeProg2 | adaptér/modul: DIL32/SOIC32 ZIF-CS 330mil (70-3331) |
| BeeProg2C | adaptér/modul: DIL32/SOIC32 ZIF-CS 330mil (70-3331) |
