Obvod: KMBDN0000M [FBGA169]
Výrobca: Samsung
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| K | Memory | |
| M | MOVI NAND/MCP | |
| X | Small Classification | A = NAND+MCU B = NAND+NAND+MCU C = NAND+NAND+NAND+NAND+MCU D = NAND+NAND+NAND+MCU H = NAND+NAND+NAND+NAND+NAND+NAND+NAND+NAND+MCU X = moviNAND+NAND+SDRAM Y = moviNAND+OneNAND+SDRAM Z = moviNAND+NAND+SDRAM+SDRAM |
| X | moviNAND Density/NAND Density/Cell/Vcc/Vccq/Organization | 0None A = 512MByte / 2G*2 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 B = 1GByte / 2G*4 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 C = 2GByte / 4G*4 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 D = 2GByte / 8G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 E = 4GByte / 8G*4 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 F = 1GByte / 8G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 G = 1GByte / 4G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 H = 3GByte / 8G*3 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 I = 512MByte / 4G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 J = 8GByte / 8G*8 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 K = 2GByte / 16G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 L = 4GByte / 16G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 M = 8GByte / 16G*4 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 N = 12GByte / 16G*6 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 O = 16GByte / 16G*8 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 P = 256MByte / 2G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 Q = 128MByte / 1G*1 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8 |
| X | LSI | A = S3C49RAX01 D = S3C49NBX01 E = S3C49VCX01 F = S3C49VCX02 G = S3C49VCX03 N = S3C49VAX02 |
| X | NOR Flash Density/Vcc/Vccq/Organization/Type/Option | 0None |
| X | NAND/OneNAND Density/Vcc/Vccq/Organizaton/Option | 0None A = 2G / 1.8V / 1.8V / x8 / SLC B = 1G OneNAND / 1.8V / 1.8V / x16 / Muxed C = 1G OneNAND / 1.8V / 1.8V / x16 D = 2G NAND_0 / 1.8V / 1.8V / x8 E = 512M / 2.7V / 2.7V / x8 F = 2G NAND_0 / 1.8V / 1.8V / x16 / SLC |
| X | UtRAM/SRAM Density/Vcc/Vccq/Organization/Option | 0None |
| X | DRAM I/F /Density/Vcc/Vccq/Organization/Option | 0None A = MDDR*2 / 1G+512M / 1.8V / 1.8V / x32 B = MDDR*2 / 512Mx2 / 1.8V / 1.8V / x32 C = MDDR / 1G / 1.8V / 1.8V / x32 D = MDDR*2 / 1G*2 / 1.8V / 1.8V / x32 E = SDR / 256M / 1.8V / 1.8V / x32 F = MDDR / 1G / 1.8V / 1.8V / x16 |
| X | Generation | M = 1st generation A = 2nd generation B = 3rd generation C = 4th generation |
| X | Package Type | A = FBGA (Hallogen-free, Lead-free) B = FBGA (Halogen-free, OSP lead-free) D = FBGA (Lead-free) E = LGA (No ball) F = FBGA H = LGA (Lead-free) P = FBGA (OSP) Q = TSOP (Lead-free) S = FBGA (MoviNAND special 2) Z = FBGA (MoviNAND special 1) |
| X | Chip Qty | 1 = 1 chip 2 = 2 chip 3 = 3 chip 4 = 4 chip 5 = 5 chip 6 = 6 chip |
| XXX | Serial Number | 300 = 19ns, 12ns, 7.5ns 301 = 19ns, 42ns, 7.5ns 302 = 19ns, 12ns, 6ns 400 = 19ns(2), 42ns, 7.5ns 401 = 19ns, 42ns, 6ns, 6ns 402 = 19ns(2), 42ns, 6ns 403 = 19ns(2), 12ns, 6ns 500 = 19ns(2), 42ns, 6ns, 6ns 501 = 19ns(2), 42ns, 7ns, 6ns 600 = 19ns(4), 42ns, 7.5ns 601 = 19ns(4), 42ns, 6ns 700 = 19ns, 42ns, 7.5ns, 7.5ns 701 = 19ns(4), 42ns, 6ns, 6ns 998 = moviNAND normal 999 = Daisychain sample |
| X | Packing Type | T = Tape&Reel 0Other (Tray, Tube, Jar) S = Stack P = Module Tape&Reel M = Module other packing |
| XX | Customer (Customer List Reference) |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: BGA-Bottom-165 (70-1009) ALEBO BGA-Top-193 ZIF-CS (a) (70-1010A) ALEBO BGA-Bottom-165 (70-1009) ALEBO BGA-Top-299 ZIF (a) (70-2811A) |
| BeeHive204AP | adaptér/modul: AP1 BGA169-1.01 eMMC-1 (71-3193) |
| BeeHive208S | adaptér/modul: BGA-Bottom-165 (70-1009) ALEBO BGA-Top-193 ZIF-CS (a) (70-1010A) ALEBO BGA-Bottom-165 (70-1009) ALEBO BGA-Top-299 ZIF (a) (70-2811A) |
| BeeHive304 | adaptér/modul: AP3 BGA169-1.01 eMMC-1 (73-3043) |
| BeeProg2 | adaptér/modul: BGA-Bottom-165 (70-1009) ALEBO BGA-Top-193 ZIF-CS (a) (70-1010A) ALEBO BGA-Bottom-165 (70-1009) ALEBO BGA-Top-299 ZIF (a) (70-2811A) |
| BeeProg2AP | adaptér/modul: AP1 BGA169-1.01 eMMC-1 (71-3193) |
| BeeProg2C | adaptér/modul: BGA-Bottom-165 (70-1009) ALEBO BGA-Top-193 ZIF-CS (a) (70-1010A) ALEBO BGA-Bottom-165 (70-1009) ALEBO BGA-Top-299 ZIF (a) (70-2811A) |
| BeeProg3 | adaptér/modul: AP3 BGA169-1.01 eMMC-1 (73-3043) |
| BeeHive204AP-AU (prestala byť podporovaná) | adaptér/modul: AP1 BGA169-1.01 eMMC-1 (71-3193) |
