Obvod: K8S5615EBx [FBGA44]
Výrobca: Samsung
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| K | Memory | |
| 8 | NOR Flash | |
| X | Small Classification | 5 = Dual bank die stack 6 = Single bank die stack 7 = Multiplexed DDP 8 = De-Multiplexed DDP A = De-Multiplexed burst B = Single bank boot block C = MLC De-Muxed D = Dual bank boot block F = MLC muxed G = MLC de-multiplexed DDP H = MLC multiplexed DDP L = Intel NOR flash P = Page mode S = Multiplexed burst T = Mitsubishi NOR flash U = Single bank uniform block |
| XX | Density | - Dual bank die stack 64 = 64M (3232,824) 65 = 64M (3232,1616) - Single bank die stack 27 = 128M(2CS) 64 = 64M(32M,32M) 55 = 256Mbit(16Mx16) - Multiplexed DDP 11 = 512M(1CS, 32Bank) 13 = 512M(2CS) 56 = 256M(16Bank) 1G = 1G(16Bank) - De-Multiplexed DDP 12 = 512M(16Bank) 13 = 512M(2CS) 56 = 256M(16Bank) 1G = 1G(16Bank) - De-Multiplexed Burst 12 = 512M(16Bank) 28 = 128M(8M,16Bank) 32 = 32M(2M, 16Bank) 56 = 256M(16Bank) 64 = 64M(4M, 16Bank) - Single Bank Boot Block 16 = 16M 27 = 128M(2CS) 28 = 128M 32 = 32M 64 = 64M 80 = 8M - MLC De-Muxed 12 = 512M(16Bank) 56 = 256M(16Bank) 1G = 1G(16Bank) - Dual Bank Boot Block(Bank1, Bank2) 15 = 16M(2M, 14M) 16 = 16M(4M, 12M) 17 = 16M(8M, 8M) 32 = 32M(8M, 24M) 33 = 32M(16M, 16M) 62 = 64M(8M, 24M) 63 = 64M(16M, 48M) 64 = 64M(24M, 40M) 65 = 64M(32M, 32M) - MLC Muxed 12 = 512M(16Bank) 56 = 256M(16Bank) 1G = 1G(16Bank) MLC De-Multiplexed DDP 11 = 512M(1CS, 32Bank) 13 = 512M(2CS) - MLC Multiplexed DDP 11 = 512M(1CS, 32Bank) 13 = 512M(2CS) - Intel NOR Flash 56 = 256M(8Bank) 28 = 128M(16Bank) - Page Mode 28 = 128M(8M, 16Bank) 56 = 256M(16Bank) 64 = 64M(4M, 16Bank) - Multiplexed Burst 12 = 512M(16Bank) 28 = 128M(8M, 16Bank) 32 = 32M(16Bank) 56 = 256M(16Bank) 64 = 64M(4M, 16Bank) - Mitsubishi NOR Flash 64 = 64M(4,4,28,28) - Single Bank Uniform Block 16 = 16M 27 = 128M(2CS) 28 = 128M 32 = 32M 64 = 64M 80 = 8M |
| XX | Organization | 08 = x8 15 = x16 16 = x8/x16 32 = x16/x32 |
| X | Power Supply | 8 = 1.8V (1.7V to 1.9V) E = 1.8V (1.7V to 1.95V) F = 1.8V / Vio=3.0V (2.2V to 3.3V) K = 2.8V (2.5V to 3.1V) L = 1.8V (1.65V to 1.95V) R = 2.0V (1.8V to 2.2V) S = 2.5V (2.3V to 2.7V) U = 3.0V / 3.3V (2.7V to 3.6V) Y = 3.0V (2.7V to 3.3V) V = 3.0V (2.7V to 3.1V) |
| X | Device Type | 1 = 4MSRAM MCP 2 = 8M SRAM MCP 3 = 16M SRAM MCP 4 = 128M SDR H-die MCP 5 = 16M UtRAM MCP 6 = 32M UtRAM MCP 7 = 128M DDR MCP 8 = OneNAND, SDRAM MCP 9 = 128M MDD A = 8M Boot block MCP(Top) B = Bottom boot block C = BootBlock(chip1-bottom, chip2-top) D = 16M Boot block MCP(Top) E = 16M Boot block MCP(Bottom) F = 16M Dual bank MCP(Top) G = 16M Dual bank MCP(Bottom) H = 32M Dual bank MCP(Top) I = 32M Dual bank MCP(Bottom) J = 64M Dual bank MCP(Top) K = 64M Dual bank MCP(Bottom) L = 4M Boot block MCP(Top) M = Top boot block in DDP N = Bottom boot block in DDP P = 256M DDR MCP Q = Top and bottom boot block S = Uniq ID T = Top boot block Z = Uniform block |
| X | Generation | M = 1st generation A = 2nd generation B = 3rd generation C = 4th generation D = 5th generation E = 6th generation F = 7th generation L = Intel 1st generation T = Mitsubishi 1st generation |
| X | Package Type | 1 = MCP C = Chip BIZ W = Wafer D = FBGA(LF) E = FBGA (LF, 1mm pitch) F = FBGA L = TBGA(LF) T = TBGA P = TSOP1(LF) S = FBGA(LF, OSP) U = FBGA(OSP) Y = TSOP1 |
| X | Temperature Range | 0None C = Commercial E = Extended I = Industrial |
| XX | Speed | 03 = 85ns 07 = 70ns 08 = 80ns 09 = 90ns 12 = 120ns 1A = 100ns(C/F 40MHz) 1B = 100ns(C/F 54MHz) 1C = 100ns(C/F 66MHz) 1D = 100ns(C/F 83MHz) 1E = 100ns(C/F 108MHz) 1F = 100ns(C/F 133MHz) 2A = 70ns/20ns(Page) 2B = 80ns/25ns(Page) 2C = 90ns/30ns(Page) 2D = 85ns/25ns(Page) 4A = 55ns/20ns(Page) 4B = 60ns/25ns(Page) 4C = 65ns/25ns(Page) 4D = 70ns/30ns(Page) 6F = 66ns(C/F 133MHz) 7A = 70ns(C/F 75MHz) 7B = 88.5ns(C/F 54MHz) 7C = 70ns(C/F 66MHz) 7D = 70ns(C/F 80MHz) 7E = 70ns(C/F 40MHz) 9A = 90ns(C/F 40MHz) 9B = 95ns(C/F 66MHz) 9C = 90ns(C/F 54MHz) 9D = 90ns(C/F 80MHz) DS = Daisychain sample 00 = None(containing exception handling code) |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: BGA-0401/0854 (70-0401/0854) = BGA-Bottom-14 (70-0401) + BGA-Top-157 ZIF-CS (70-0854) |
| BeeHive208S | adaptér/modul: BGA-0401/0854 (70-0401/0854) = BGA-Bottom-14 (70-0401) + BGA-Top-157 ZIF-CS (70-0854) |
| BeeProg2 | adaptér/modul: BGA-0401/0854 (70-0401/0854) = BGA-Bottom-14 (70-0401) + BGA-Top-157 ZIF-CS (70-0854) |
| BeeProg2C | adaptér/modul: BGA-0401/0854 (70-0401/0854) = BGA-Bottom-14 (70-0401) + BGA-Top-157 ZIF-CS (70-0854) |
