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Obvod: K5E1G13ACM [FBGA137]

Výrobca: Samsung

Popis čísla dielu pre toto zariadenie:

Nabehnutím kurzora zvýraznite konkrétnu sekciu
K5 Samsung MCP Memory  
X Device Type A = NOR DB Flash + fCMOS SRAM
B = NOR BB Flash + fCMOS SRAM
C = Mitsubishi NOR + fCMOS SRAM
D = NAND Flash + SDRAM
E = NAND Flash + DDR SDRAM
F = NOR DB Flash + NAND Flash
G = Muxed NOR Flash + SDRAM
H = NOR DB Flash + SDRAM
J = NOR DB Flash + SDRAM
K = De-Muxed NOR Flash + SDRAM
L = De-Muxed NOR Flash + UtRAM
M = NOR BB Flash + TFT SRAM
N = Muxed NOR Flash + Muxed UtRAM
P = NAND Flash + Muxed UtRAM
Q = NAND Flash + UtRAM
R = OneNAND + SDRAM
S = UtRAM + fCMOS SRAM
T = Mitsubishi NOR Flash + UtRAM
U = Muxed NOR Flash + OneNAND
V = NOR DB Flash + OneNAND
W = OneNAND + DDR SDRAM
X = Muxed NOR + SDRAM
Z = NOR DB Flash + DDR SDRAM
XX First Chip Density - when 1st chip is NOR DB Flash (x8/x16)
32 = 32Mbit (8Mbit + 24Mbit)
33 = 32Mbit (16Mbit + 16Mbit)
63 = 64Mbit (16Mbit + 48Mbit)
- when 1st chip is NOR BB Flash (x16)
16 = 16Mbit
32 = 32Mbit
64 = 64Mbit
- when 1st chip is NAND Flash (x8)
12 = 512Mbit
28 = 128Mbit
56 = 256Mbit
57 = 256Mbit (x16)
- when 1st chip is UtRAM
64 = 64Mbit
1G = 1Gbit
32 = 32Mbit
- when 1st chip is Mitsubishi NOR Flash
64 = 64Mbit (4Mbit+4Mbit+28Mbit+28Mbit)
- when 1st chip is Muxed NOR Flash
28 = 128Mbit (8Mx16, 16Bank)
56 = 256Mbit (16Mx16, 16Bank)
64 = 64Mbit (4Mx16, 16Bank)
- when 1st chip is De-Muxed NOR Flash
28 = 128Mbit (8Mbit, 16Bank)
56 = 256Mbit (x16)
64 = 64Mbit (16Mbit+48Mbit)
66 = 64Mbit (4Mx16, 8Bank)
- when 1st chip is OneNAND
12 = 512Mbit (x16)
56 = 256Mbit (x16)
1G = 1Gbit (x16)
XX Second Chip Density - when 2nd chip is fCMOS SRAM
17 = 16Mbit (x16)
40 = 4Mbit (x8 / x16)
41 = 4Mbit (x16)
80 = 8Mbit (x8 / x16)
81 = 8Mbit (x16)
- when 2nd chip is TFT SRAM
21 = 2Mbit (x8)
- when 2nd chip is NAND Flash
64 = 64Mbit (x8)
- when 2nd chip is UtRAM
16 = 16Mbit (x16)
28 = 128Mbit (x16, Burst)
32 = 32Mbit (x16)
31 = 32Mbit (x16, Page)
64 = 64Mbit (x16, Burst)
66 = 64Mbit (x16)
- when 2nd chip SDRAM
12 = 512Mbit (x16)
13 = 512Mbit (x32)
28 = 128Mbit (x32)
29 = 128Mbit (x16)
57 = 256Mbit (x16)
58 = 256Mbit (x32)
- when 2nd chip is DDR SDRAM
12 = 512Mbit (x16)
13 = 512Mbit (x32)
28 = 128Mbit (x32)
29 = 128Mbit (x16)
57 = 256Mbit (x16)
58 = 256Mbit (x32)
- when 2nd chip is Muxed SRAM
17 = 16Mbit (x16)
41 = 4Mbit (x16)
81 = 8Mbit (x16)
- when 2nd chip is Muxed UtRAM
16 = 16Mbit (x16)
- when 2nd chip is OneNAND
28 = 128Mbit (x16)
56 = 256Mbit (x16)
X Operating Voltage Range 8 = 1.7V to 1.9V
A = 1.8V / 1.8V
B = 2.6V / 2.6V
C = 3.0V / 3.0V
D = 2.6V / 1.8V
E = 3.3V / 2.5V
F = 2.8V
H = 3.0V / 2.5V
K = 1.9V / 1.9V
L = 3.3V / 1.8V
V = 3.3V / 3.3V
Y = 2.7V to 3.3V
- only 1st chip is NAND Flash
6 = 2.4V to 2.8V
- when 1st chip and 2nd chip is different
G = 1.8V / 1.8V, 3.0V / 1.8V
J = 1.8V / 1.8V, 2.6V / 1.8V
X Flash Boot Block Mode A = Top & bottom boot block
B = Bottom boot block
C = Uniform block
T = Top boot block
0None
X Generation M = 1st generation
A = 2nd generation
B = 3rd generation
C = 4th generation
D = 5th generation
E = 6th generation
F = 7th generation
G = 8th generation
X Package Type A = FBGA (HF, LF)
D = FBGA (LF)
E = LGA (No BAll)
F = FBGA
H = LGA (LF)
K = TBGA (Intell Ball Out)
P = FBGA (OSP)
S = FBGA (OSP LF)
T = TBGA
L = TBGA (LF)
X 1st Chip Speed - when 1st chip is NOR DB/BB & Mitsubishi NOR & UtRAM
2 = 65ns
3 = 85ns
7 = 70ns (except UtRAM)
8 = 80ns
9 = 90ns
- when 1st chip is burst
A = 100ns (C/F 40MHz)
B = 100ns (C/F 54MHz)
C = 90ns (C/F 40MHz)
G = 90ns (C/F 54MHz)
E = 88.5ns (C/F 54MHz)
F = 70ns (C/F 66MHz)
H = 14.5ns (C/F 54MHz)
- when 1st chip is OneNAND
J = 18.5ns (C/F 54MHz)
K = 15ns (C/F 66MHz)
- MCP common
0None
N = No Bin (TPB)
XX 2nd Chip Speed - when 2nd chip is fCOM SRAM & UtRAM(Muxed)
10 = 100ns
18 = 18.5ns
50 = 50ns
55 = 55ns
60 = 60ns
70 = 70ns
85 = 85ns
90 = 90ns
DS = Daisychain
- when 2nd chip is Muxed SRAM
10 = 100ns
70 = 70ns
85 = 85ns
90 = 90ns
DS = Daisychain
- when 2nd chip is SDRAM/DDR SDRAM
15 = 15ns@CL2
60 = 6ns@CL3
75 = 7.5ns@CL3
85 = 8.5ns@CL3
90 = 9ns@CL3
95 = 9.5ns@CL3
1H = 10ns@CL2
1L = 10ns@CL3
9H = 9ns@CL2
DS = Daisychain
- when 2nd chip is Burst UtRAM
54 = 54MHz
66 = 66MHz
- when 2nd chip is OneNAND
76 = 76ns
DS = Daisychain
- MCP common
00 = None
X Packing Type T = Tape&Reel
Number = Other(Tray, Tube, Jar)
S = Stack
XX Customer "Customer List Reference"  

Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.

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