Obvod: NX857 [VFBGA63]
Výrobca: Micron
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| MT | Micron Technology | |
| XXX | Product Family | 29F = Single-supply NAND flash 29E = Enterprise NAND flash 29H = High-speed NAND flash |
| XX | Density | 1G = 1Gbit 2G = 2Gbit 4G = 4Gbit 8G = 8Gbit 16G = 16Gbit 32G = 32Gbit 64G = 64Gbit 128G = 128Gbit 256G = 256Gbit 512G = 512Gbit 1T = 1Tbit 2T = 2Tbit 4T = 4Tbit |
| XX | Device Width | 01 = 1bit 08 = 8 bits 16 = 16bits |
| X | Level | A = SLC B = Reserved C = MLC-2 E = TLC |
| X | Classification | A = 1 die, 0 nCE, 0 RnB, 1 I/O channel B = 1 die, 1 nCE, 0 RnB, 1 I/O channel D = 2 dies, 1 nCE, 1RnB, 1 I/O channel E = 2 dies, 2 nCE, 2 RnB, 2 I/O channels F = 2 dies, 2 nCE, 2 RnB, 1 I/O channel G = 3 dies, 3 nCE, 3 RnB, 3 I/O channels J = 4 dies, 2 nCE, 2 RnB, 1 I/O channel K = 4 dies, 2 nCE, 2 RnB, 2 I/O channels L = 4 dies, 4 nCE, 4 RnB, 4 I/O channel M = 4 dies, 4 nCE, 4 RnB, 2 I/O channels Q = 8 dies, 4 nCE, 4 RnB, 4 I/O channel R = 8 dies, 2 nCE, 2 RnB, 2 I/O channels T = 16 dies, 8 nCE, 4 RnB, 2 I/O channel U = 8 dies, 4 nCE, 4 RnB, 2 I/O channels V = 16 dies, 8 nCE, 4RnB, 4 I/O channels |
| X | Operating Voltage Range | A = Vcc: 3.3V (2.70V to 3.60V), Vccq: 3.3V (2.70V to 3.60V) B = Vcc: 1.8V (1.70V to 1.95V), Vccq: 1.8V (1.70V to 1.95V) C = Vcc: 3.3V (2.70V to 3.60V), Vccq: 1.8V (1.70V to 1.95V) E = Vcc: 3.3V (2.70V to 3.60V), Vccq: 3.3V (2.70V to 3.60V) or 1.8V (1.70V to 1.95V) F = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.2V (1.14V to 1.26V) G = Vcc: 3.3V (2.60V to 3.60V), Vccq: 1.8V (1.70V to 1.95V) H = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.2V (1.14V to 1.26V) or 1.8V (1.70V to 1.95V) J = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.8V (1.70V to 1.95V) K = Vcc: 3.3V (2.60V to 3.60V), Vccq: 3.3V (2.60V to 3.60V) L = Vcc: 3.3V (2.60V to 3.60V), Vccq: 3.3V (2.60V to 3.60V) or 1.8V (1.70V to 1.95V) |
| X | Generation Feature Set | A = 1-st set of device features B = 2-nd set of device features (only if different than 1-st set) C = 3-rd set of device features (only if different) D = 4-th set of device features (only if different) etc. |
| X | Interface | A = Asynchronous only B = Synchronous/Asynchronous C = Synchronous only D = SPI |
| XX | Package Code | SF = 16-pin SOP, 300mils WP = 48-pin TSOP I (CPL version, Pb-free) WC = 48-pin TSOP I (OCPL version, Pb-free) WB = 8-pin U-PDFN, 6x8x0.65 C3 = 52-pad ULGA, 12x17x0.65 C4 = 52-pad VLGA, 12x17x1.0(SDP/DDP/QDP) C5 = 52-pad VLGA, 14x18x1.0(SDP/DDP/QDP) C6 = 52-pad LLGA, 14x18x1.47(DDP/QDP/8DP) C7 = 48-pad LLGA, 12x20x1.47(8DP) C8 = 52-pad WLGA, 14x18x0.75(DDP/QDP) G1 = 272-ball VBGA, 14x18x1.0 (SDP, DDP, 3DP, QDP) G2 = 272-ball VBGA, 14x18x1.3 (QDP, 8DP) G6 = 272-ball VBGA, 14x18x1.5 (16DP) H1 = 100-ball VBGA (Pb-free), 12x18x1.0 H2 = 100-ball TBGA (Pb-free), 12x18x1.2 H3 = 100-ball LBGA (Pb-free), 12x18x1.4 (DDP/QDP/8DP) H4 = 63-ball VFBGA, 9x11x1 HC = 63-ball VFBGA, 10.5x13x1.0 H6 = 152-ball VBGA, 14x18x1.0 (SDP, DDP) H7 = 152-ball TBGA, 14x18x1.2 (QDP) H8 = 152-ball LBGA, 14x18x1.4 (8DP) H9 = 100-ball LBGA, 12x18x1.6 (16DP) J1 = 132-ball VBGA, 12x18x1.0 (SDP, DDP) J2 = 132-ball TBGA, 12x18x1.2 (QDP) J3 = 132-ball LBGA, 12x18x1.4 (8DP) J4 = 132-ball VBGA, 12x18x1.0 (SDP, DDP) J5 = 132-ball TBGA, 12x18x1.2 (QDP) J6 = 132-ball LBGA, 12x18x1.4 (8DP) J7 = 152-ball LBGA, 14x18x1.5 (16DP) J9 = 132-ball LBGA, 12x18x1.5 (16DP) 12 = 24-ball T-PBGA, 6x8x1.5 |
| XX | Speed Grade (Synchronous) | Blank = Asynchronous only 20 = 100MT/s 15 = 133MT/s 12 = 166MT/s 10 = 200MT/s 6 = 333MT/s 5 = 400MT/s 4 = 533MT/s 3 = 667MT/s |
| XX | Temperature Range | Blank = Commercial (0°C to 70°C) AAT = Automotive Industrial (-40°C to 105°C) AIT = Automotive Industrial (-40°C to 85°C) IT = Extended (-40°C to 85°C) WT = Wirelles (-25°C to 85°C) |
| X | Special Options | E = Error correction with internal ECC enabled M = Media R = MLC+Features X = Premium lifecycle product (PLP) S = Security features Z = Polyimide (if applicable) |
| XX | Production Status | Blank = Production ES = Engineering samples QS = Qualification samples MS = Mechanical samples |
| : | ||
| X | Design Revision (Shrink) | A = 1-st design revision B = 2-nd design revision etc. |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) |
| BeeHive204AP | adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) |
| BeeHive208S | adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) |
| BeeHive304 | adaptér/modul: AP3 BGA63-1.12 NAND-1 (73-3166) ALEBO AP3 BGA63-1.13 CS NAND-1 (73-4250) |
| BeeProg2 | adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) |
| BeeProg2AP | adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) |
| BeeProg2C | adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) |
| BeeProg3 | adaptér/modul: AP3 BGA63-1.12 NAND-1 (73-3166) ALEBO AP3 BGA63-1.13 CS NAND-1 (73-4250) |
| BeeHive204AP-AU (prestala byť podporovaná) | adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) |
