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Obvod: S29GL01GTxxDHxV2 [FBGA64]

Výrobca: Infineon

Popis čísla dielu pre toto zariadenie:

Nabehnutím kurzora zvýraznite konkrétnu sekciu
S Spansion Memory  
XX Product Series 29 = Sector erase NOR Flash memory
70 = Page-mode Flash memory
X Flash Interface And Simultaneous Read-Write J = Standard, simultaneous read-write
A = Standard, no simultaneous read-write
P = Page, simultaneous read-write
G = Page, no simultaneous read-write
W = Burst (Demux add/data), simultaneous read-write
R = Burst (Demux add/data), no simultaneous read-write
N = Burst (Mux add/data), simultaneous read-write
K = Burst (Mux add/data), no simultaneous read-write
C = Automotive burst (Demux), simultaneous read-write
V = Value family, simutaneous read-write,
burst mode flash memory with multiplexed I/O
X = Address-high, address-low, data multiplexed
X Core Voltage F = 5.0 V Vcc
L = 3.0 V Vcc
D = 2.5 V Vcc
S = 1.8V Vcc
XXX Density 001-999 = 1Mb - 999Mb
01G-64G = 1Gb - 64Gb
X Process Technology B = 320 nm, Floating gate technology
C = 320 nm, Floating gate technology
D = 200 nm, Floating gate technology
G = 170 nm, Floating gate technology
H = 130 nm, Floating gate technology
J = 110 nm, Floating gate technology
M = 230 nm, MirrorBit technology
A = 200 nm MirrorBit technology
N = 110 nm, MirrorBit technology
P = 90 nm, MirrorBit technology
K = 90 nm Floating gate technology
R = 65 nm, MirrorBit technology
S = 65nm, MirrorBit Eclipse technology
T = 45 nm, MirrorBit Eclipse technology
XX Speed Option/Clock Rate - represents random access time (ns).
If greater than 100 ns, use the two leftmost digits
Clock rate suffix:
AA = 104 MHz
0P = 66 MHz
OS = 83 MHz
AB = 104 MHz
X Package Type B = FBGA
BH = Very Thin Fine-Pitch BGA
C = CSOP (Lead Frame)
E = Super CSP (BGA)
D, F, G = Fortified BGA
M = SOIC/SOP (Lead Frame)
N = WSON (Lead Frame)
Q = Plastic QFP
T = TSOP
S = SOP
X Package Material Set Blank
A = Standard, not lead (Pb)-free
F = Standard, lead (Pb)-free
J = (Pb)-free, LF35 package
H = Low halogen, PB-free
X Temperature Range E = Engineering samples
C = Commercial (0°C to 70°C)
W = Wireless (-25°C to 85°C)
I = Industrial (-40°C to 85°C)
N = Extended (-40°C to 125°C)
A = Automotive
XX Additional Ordering Option/Model Number e.g. R0, R1, R2 ... R9, S1..S4, or other two digits number
X Packing Type 0Tray
1 = Tube
2 = 7\\\'\\\' Tape & Reel
3 = 13\'\' Tape & Reel

Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.

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Podporovaný programátormi a programovacími adaptérmi/modulmi:

BeeHive204 adaptér/modul: BGA-0948/0964 (70-0948/0964) = BGA-Bottom-125 (70-0948) + BGA-Top-182 ZIF-CS (70-0964)
BeeHive204AP - ALEBO AP1 BGA64-1.2 ZIF NOR-1 (discontinued) or AP1 BGA-0948/0964 (discontinued)
BeeHive208S adaptér/modul: BGA-0948/0964 (70-0948/0964) = BGA-Bottom-125 (70-0948) + BGA-Top-182 ZIF-CS (70-0964)
BeeProg2 adaptér/modul: BGA-0948/0964 (70-0948/0964) = BGA-Bottom-125 (70-0948) + BGA-Top-182 ZIF-CS (70-0964)
BeeProg2AP - ALEBO AP1 BGA64-1.2 ZIF NOR-1 (discontinued) or AP1 BGA-0948/0964 (discontinued)
BeeProg2C adaptér/modul: BGA-0948/0964 (70-0948/0964) = BGA-Bottom-125 (70-0948) + BGA-Top-182 ZIF-CS (70-0964)
BeeHive204AP-AU (prestala byť podporovaná) - ALEBO AP1 BGA64-1.2 ZIF NOR-1 (discontinued) or AP1 BGA-0948/0964 (discontinued)
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