Obvod: HYC0SEF0MF3 [FBGA137]
Výrobca: Hynix
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| HY | Hynix Memory | |
| X | Product Group | A = NAND B = NAND+NAND C = NAND+mobile SDRAM D = NAND+mobile DDR E = NAND+NAND+mobile SDRAM F = NAND+NAND+mobile DDR G = NAND+mobile SDRAM+mobile SDRAM H = NAND+LP DDR+LP DDR I = NAND+NAND+mobile SD+mobile SD |
| X | Small Classification | 0None 1 = Pseudo SRAM 2 = Pseudo SRAM+pseudo SRAM 3 = SRAM 4 = SRAM+SRAM 5 = Pseudo SRAM+SRAM 6 = Pseudo+Pseudo+SRAM 7 = Pseudo+SRAM+SRAM |
| X | Vcc (Flash / RAM) | V = 2.7V / 2.7V U = 2.7V / 1.8V L = 1.8V / 2.7V S = 1.8V / 1.8V |
| X | Flash Density | A = 16Mx8 B = 8Mx16 C = 32Mx8 D = 16Mx16 E = 64Mx8 F = 32Mx16 G = 128Mx8 H = 64Mx16 I = 256Mx8 J = 128Mx16 |
| X | DRAM Density | 0None A = 4Mx16 B = 2Mx32 C = 8Mx16 D = 4Mx32 E = 16Mx8 F = 8Mx32 G = 32Mx16 H = 16Mx32 I = 64Mx16 J = 32Mx32 |
| X | Pseudo / SRAM Density | 0None A = 512Kx16 B = 256Kx32 C = 1Mx16 D = 512Kx32 E = 2Mx16 F = 1Mx32 G = 4Mx16 H = 2Mx32 I = 8Mx16 J = 4Mx32 K = 16Mx16 L = 8Mx32 |
| X | Generation | M = 1st generation A = 2nd generation B = 3rd generation C = 4th generation |
| X | Package Type | F = FBGA |
| X | Customer Option | 1 = FBGA 149 ball 2 = FBGA 107 ball 3 = FBGA 137 ball |
| X | Package Material | Blank = Normal P = Lead free |
| X | NAND Flash Speed | 5 = 50ns 6 = 60ns 8 = 80ns |
| X | NAND Flash Mode | S = 512 Byte Page Buffer L = 2K Byte Page Buffer |
| X | Mobile SDR / DDR Speed | 0None S = 105MHz / DDR200@CL3 P = 105MHz / DDR200@CL2 H = 133MHz / DDR266@CL3 B = 66MHz@CL2 |
| X | Pseudo SRAM SPeed | 0None L = 80ns F = 70ns V = 60ns U = 55ns A = 66MHz@CL4 C = 104MHz@CL4 D = 108MHz@CL4 E = 133MHz@CL4 |
| X | Temparature Range | C = 0°C to 70°C E = -30°C to 85°C I = -40°C to 85°C |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: DIL48/BGA137-1 ZIF NAND-1 (70-3113) = ALEBO BGA-1024/1129 (70-1024/1129) ALEBO BGA-Bottom-166 (70-1024) |
| BeeHive208S | adaptér/modul: DIL48/BGA137-1 ZIF NAND-1 (70-3113) = ALEBO BGA-1024/1129 (70-1024/1129) ALEBO BGA-Bottom-166 (70-1024) |
| BeeProg2 | adaptér/modul: DIL48/BGA137-1 ZIF NAND-1 (70-3113) = ALEBO BGA-1024/1129 (70-1024/1129) ALEBO BGA-Bottom-166 (70-1024) |
| BeeProg2C | adaptér/modul: DIL48/BGA137-1 ZIF NAND-1 (70-3113) = ALEBO BGA-1024/1129 (70-1024/1129) ALEBO BGA-Bottom-166 (70-1024) |
