Obvod: HY27UH08AGDM [TLGA52]
Výrobca: Hynix
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| HY | Hynix Memory | |
| 27 | Device Family | 27 = NAND Flash |
| X | Power Supply | U = 2.7V to 3.6V L = 2.7V S = 1.8V |
| X | Classification | S = Single Level Cell + Single Die + S/B A = Single Level Cell + Double Die + S/B B = Single Level Cell + Quadruple Die + S/B F = Single Level Cell + Single Die + L/B G = Single Level Cell + Double Die + L/B H = Single Level Cell + Quadruple Die + L/B M = Multi Level Cell + Single Die + S/B O = Multi Level Cell + Double Die + S/B P = Multi Level Cell + Quadruple Die + S/B T = Multi Level Cell + Single Die + L/B U = Multi Level Cell + Double Die + L/B V = Multi Level Cell + Quadruple Die + L/B W = Multi Level Cell + L/B |
| XX | Bit Organization | 08 = x8 16 = x16 32 = x32 |
| XX | Density | 64 = 64Mbit 28 = 128Mbit 56 = 256Mbit 12 = 512Mbit 1G = 1Gbit 2G = 2Gbit 4G = 4Gbit 8G = 8Gbit AG = 16Gbit BG = 32Gbit CG = 64Gbit DG = 128Gbit |
| X | Mode | 1 = 1nCE & 1R/nB; Sequencial Row Read Enable 2 = 1nCE & 1R/nB; Sequencial Row Read Disable 4 = 2nCE & 2R/nB; Sequencial Row Read Enable 5 = 2nCE & 2R/nB; Sequencial Row Read Disable 6 = 1nCE &1R/nB; Sequencial Row Read Enable & Auto Read Page 0 7 = 2nCE & 2R/nB; Sequencial Row Read Enable & Auto Read Page 0 8 = 1nCE &1R/nB; Sequencial Row Read Disable & Auto Read Page 0 9 = 2nCE &2R/nB; Sequencial Row Read Disable & Auto Read Page 0 D = Dual interface; Sequential Row Read Disable F = 4nCE & 4R/B; Sequencial Row Read Disable |
| X | Version | M = 1st Generation A = 2nd Generation B = 3rd Generation C = 4th Generation 1 = Down Density (1st) 2 = Down Density (2nd) |
| X | Package Type | T = TSOP V = WSOP S = USOP F = FBGA (63ball) B = FBGA (107ball) G = FBGA (149ball) H = TBGA L = LGA U = ULGA W = Wafer C = Chip K = KGB D = PGD2 |
| X | Package Material | Blank = Normal, Wafer, Chip, KGB P = Lead Free H = Halogen Free R = Lead & Halogen Free |
| X | Operating Temperature | Blank = Wafer, Chip C = 0°C to 70°C E = -25°C to 85°C M = -30°C to 85°C I = -40°C to 85°C |
| X | Bad Block | Blank = Wafer B = Included Bad Block S = 1 - 5 Bad Block P = All Good Block |
| X | Customer Initial Option |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: LGA-0924/1352 (70-0942/1352) = LGA-Bottom-121 (70-0924) + LGA-Top-165 ZIF-CS (70-1352) = |
| BeeHive208S | adaptér/modul: LGA-0924/1352 (70-0942/1352) = LGA-Bottom-121 (70-0924) + LGA-Top-165 ZIF-CS (70-1352) = |
| BeeProg2 | adaptér/modul: LGA-0924/1352 (70-0942/1352) = LGA-Bottom-121 (70-0924) + LGA-Top-165 ZIF-CS (70-1352) = |
| BeeProg2C | adaptér/modul: LGA-0924/1352 (70-0942/1352) = LGA-Bottom-121 (70-0924) + LGA-Top-165 ZIF-CS (70-1352) = |
