Obvod: H27U1G8F2C [FBGA63]
Výrobca: Hynix
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| H | Hynix | |
| X | Product Family | 2 = Flash |
| X | Product Mode | 7 = NAND Flash |
| X | Power Supply | U = 2.7V to 3.6V L = 2.7V S = 1.8V |
| XX | Density | 64 = 64Mb 12 = 128Mb 25 = 256Mb 51 = 512Mb 1G = 1Gb 2G = 2Gb 4G = 4Gb 8G = 8Gb AG = 16Gb BG = 32Gb CG = 64Gb DG = 128Gb |
| X | Organization | 8 = x8 16 = x16 |
| X | NAND Classification | S = SLC + Single die + Small block A = SLC + Double die + Small block B = SLC + Quadrupple die + Small block F = SLC + Single die + Large block G = SLC + Double die + Large block H = SLC + Quadruple die + Large block K = SLC + DSP + Large block T = MLC + Single die + Large block U = MLC + Double die + Large block V = MLC + Quadruple die + Large block W = MLC + DSP + Large block |
| X | Function Mode | 1 = 1nCE & 1R/nB, Sequential row read enable 2 = 1nCE & 1R/nB, Sequential row read disable 4 = 2nCE & 2R/nB, Sequential row read enable 5 = 2nCE & 2R/nB, Sequential row read disable D = Dual interface, Sequential row read disable F = 4nCE & 4R/nB, Sequential row read disable |
| X | Die Generation | M = 1st generation A = 2nd generation B = 3rd generation C = 4th generation |
| X | Package Type | T = TSOP1 V = WSOP S = USOP W = Wafer D = PGD2 Y = TLGA U = ULGA F = FBGA C = PGD1 (chip) K = KGD |
| X | Package Material | A = Wafer P = Lead free L = Leaded R = Lead & Halogen free |
| X | Bad Block | B = Included bad block S = 1~5 bad block included P = All good block |
| X | Operation Temperature | C = Commercial (0°C to 70°C) E = Extended (-25°C to 85°C) M = Mobile (-30°C to 85°C) I = Industrial (-40°C to 85°C) |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) |
| BeeHive204AP | adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) |
| BeeHive208S | adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) |
| BeeHive304 | adaptér/modul: AP3 BGA63-1.12 NAND-1 (73-3166) ALEBO AP3 BGA63-1.13 CS NAND-1 (73-4250) |
| BeeProg2 | adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) |
| BeeProg2AP | adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) |
| BeeProg2C | adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) |
| BeeProg3 | adaptér/modul: AP3 BGA63-1.12 NAND-1 (73-3166) ALEBO AP3 BGA63-1.13 CS NAND-1 (73-4250) |
| BeeHive204AP-AU (prestala byť podporovaná) | adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) |
