Obvod: S72XS256RE0AHBJ [FBGA133]
Výrobca: Cypress
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| S | Spansion Memory | |
| XX | Product Series | 72 = Multi-chip product (MCP) |
| X | Flash Interface And Simultaneous Read-Write | J = Standard, simultaneous read-write A = Standard, no simultaneous read-write P = Page, simultaneous read-write G = Page, no simultaneous read-write W = Burst (Demux add/data), simultaneous read-write R = Burst (Demux add/data), no simultaneous read-write N = Burst (Mux add/data), simultaneous read-write K = Burst (Mux add/data), no simultaneous read-write C = Automotive burst (Demux), simultaneous read-write V = Simultaneous Read/Write, Burst mode with multiplexed I/O X = Address-high, address-low, data multiplexed |
| X | Core Voltage | F = 5.0 V Vcc L = 3.0 V Vcc D = 2.5 V Vcc S = 1.8V Vcc |
| XXX | Density | 001-999 = 1Mb - 999Mb 01G-64G = 1Gb - 64Gb |
| X | Process Technology | B = 320 nm, Floating gate technology C = 320 nm, Floating gate technology D = 200 nm, Floating gate technology G = 170 nm, Floating gate technology H = 130 nm, Floating gate technology J = 110 nm, Floating gate technology M = 230 nm, MirrorBit technology A = 200 nm MirrorBit technology N = 110 nm, MirrorBit technology P = 90 nm, MirrorBit technology K = 90 nm, Floating gate technology R = 65 nm, MirrorBit technology |
| XX | DRAM and Data Flash Density | D0 = 128Mb DRAM, no Data Flash E0 = 256Mb DRAM, no Data Flash |
| XX | Package Type | AF = Thin profile Fine-pitch BGA Pb-free package (0.5 mm pitch, 1.0 mm height) AJ = Thin profile Fine-pitch BGA Pb-free LF35 package (0.5 mm pitch, 1.0 mm height) ZJ = Thin profile Fine-pitch BGA Pb-free LF35 package (0.5 mm pitch, 1.2 mm height) |
| X | Temperature Range | Blank E = Engineering samples C = Commercial (0°C to 70°C) W = Wireless (-25°C to 85°C) I = Industrial (-40°C to 85°C) N = Extended (-40°C to 125°C) |
| X | Package Modifier | 1 = DDR DRAM, 133-ball, 8.0x8.0 mm, FBGA multi-chip package 7 = DDR DRAM, 133-ball, 11x10 mm, FBGA multi-chip package |
| X | Model Number | K = DRAM type 1, 66 MHz flash/133 Mhz DRAM J = DRAM type 1, 80 MHz flash/133 MHz DRAM 3 = DRAM type 5, 66 MHz flash/133 MHz DRAM 2 = DRAM type 5, 80 MHz flash/133 MHz DRAM |
| X | Packing Type | 0Tray 1 = Tube 2 = 7\\\'\\\' Tape & Reel 3 = 13\'\' Tape & Reel |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051) |
| BeeHive208S | adaptér/modul: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051) |
| BeeProg2 | adaptér/modul: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051) |
| BeeProg2C | adaptér/modul: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051) |
