Obvod: EPCQ64 [SOIC16]
Výrobca: Altera
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| XXX | Family Signature | EP = APEX, ACEX or Classic family EPF = FLEX family EPC, EPCE = Configuration devices EPM = MAX family EPCS = Serial configurations devices EPCQ = Quad-Serial configurations devices |
| XXXXXXX | Device Type Number | |
| X | Package Type | B = Ball-grid array (BGA) D = Ceramic dual in-line package (CerDIP) F = FineLine BGA G = Ceramic pin-grid array (PGA) J = Ceramic JLCC L = Plastic J-lead chip carrier (PLCC) P = Plastic dual in-line package (PDIP) Q = Plastic quad flat pack (PQFP) R = Power quad flat pack (RQFP) S = Plastic small-outline integrated circuit (SOIC) T = TQFP U = Ultra FineLine BGA |
| X | Operating Temperature | C = Commercial (0°C to 85°C) I = Industrial (-40°C to 100°C) A = Automotive (-40°C to 125°C) M883B = Military (-55°C to 125°C) for MAX family: C = Commercial (0°C to 90°C) I = Industrial (-40°C to 105°C) A = Automotive (-40°C to 125°C) M883B = Military (-55°C to 125°C) |
| XXX | Pin Count | - number of pins for devices with different pin-count options |
| X | Speed Grade | 3 = 3 ns 4 = 4 ns 5 = 5 ns 6 = 6 ns 7 = 7.5 ns 10 = 10 ns 12 = 12 ns 15 = 15 ns 20 = 20 ns 25 = 25 ns 30 = 30 ns 35 = 35 ns 45 = 45 ns 50 = 50 ns 55 = 55 ns |
| X | Optional Suffix | - indicates specific device options or shipment method C = carrier DX = FLEX 10K devices with CloclLock & ClockBoost circuitry ES = Engineering sample F = Fixed programming algorithm H = Special dry-packaging shipment option for MAX7000 devices P = Special PCI compliance on selecected devices T = Devices permanently set in turbo (high-speed) mode X = APEX 20K, APEX 20KE, FLEX 10K, and FLEX 10KE devices with PLLs and LVDS, if applicable V = 5.0 V tolerant inputs N = Lead-free |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A) |
| BeeHive204AP | adaptér/modul: AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096) |
| BeeHive208S | adaptér/modul: DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A) |
| BeeHive304 | adaptér/modul: AP3 SOIC16-300 SFlash-1a (73-4441) ALEBO AP3 SOIC16-300 SFlash-1 (discontinued) |
| BeeProg2 | adaptér/modul: DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A) |
| BeeProg2AP | adaptér/modul: AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096) |
| BeeProg2C | adaptér/modul: DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A) |
| BeeProg3 | adaptér/modul: AP3 SOIC16-300 SFlash-1a (73-4441) ALEBO AP3 SOIC16-300 SFlash-1 (discontinued) |
| BeeHive204AP-AU (prestala byť podporovaná) | adaptér/modul: AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096) |
| MEMprog2 (prestala byť podporovaná) | adaptér/modul: DIL16W/SOIC16 ZIF 300mil (70-0881) |
| SmartProg2 (prestala byť podporovaná) | adaptér/modul: DIL16W/SOIC16 ZIF 300mil (70-0881) |
