Obvod: APA300 [FBGA144](STP)
Výrobca: Actel
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| XXXXX | Device Family | AFS = Fusion devices M7AFS = Fusion devices with ARM7 M1AFS = Fusion devices with Cortex-M1 A3P = ProASIC3 devices M7A3P = ProASIC3 devices with ARM7 M1A3P = ProASIC3 devices with Cortex-M1 AGL = IGLOO devices M1AGL = IGLOO devices with Cortex-M1 A3PE = ProASIC3E devices AGLE = IGLOO devices M1AGLE = IGLOO devices with Cortex-M1 AGLN = IGLOO nano devices AGLP = IGLOO PLUS devices A3PN = ProASIC3 nano devices M1A3PE = ProASIC3E devices with Cortex-M1 M7A3PE = ProASIC3E devices with ARM7 P1AFS = Pigeon Point Fusion devices U1AFS = MicroBlade Fusion devices |
| XXXX | System Gates Count | 010 = 10000 system gates 015 = 15000 system gates 030 = 30000 system gates 060 = 60000 system gates 090 = 90000 system gates 125 = 125000 system gates 250 = 250000 system gates 400 = 400000 system gates 600 = 600000 system gates 1000 = 1000000 system gates 1500 = 1500000 system gates 3000 = 3000000 system gates |
| X | Power | Blank = Standard L = Low-power |
| XX | Supply Voltage | Blank V2 = 1.2V to 1.5V V5 = 1.5V |
| X | Enhanced Features | Blank = Standard Z = Devices without enhanced features |
| X | Speed Grade | Blank = Standard F = 20\\\\% slower than standard 1 = 15\\% faster than standard 2 = 25\% faster than standard |
| XX | Package Type | QN = Quad flat no lead (0.5mm pitch) PQ = Plastic quad flat pack (0.5mm pitch) FG = Fine pitch ball grid array (1.0mm pitch) VQ = Very thin quad flat pack (0.5mm pitch) TQ = Thin quad flat pack (0.5mm pitch) UC = Micro chip scale package (0.4mm pitch) CS = Chip scale package (0.5mm pitch) |
| X | Lead-free Packaging Options | Blank = Standard packaging G = RoHS-compliant (green) packaging |
| XXX | Package Lead Count | |
| X | Application (Ambient Temperature Range) | Blank = Commercial (0°C to 70°C) I = Industrial (-40°C to 85°C) PP = Pre-production ES = Engineering silicon (room temperature only) |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: BGA-2324/0887 (70-2324/0887) = BGA-Bottom-140 (70-2324) + BGA-Top-155 ZIF (70-0887) |
| BeeHive208S | adaptér/modul: BGA-2324/0887 (70-2324/0887) = BGA-Bottom-140 (70-2324) + BGA-Top-155 ZIF (70-0887) |
| BeeHive304 | adaptér/modul: AP3 BGA144-4 PLD-2 (73-3872) |
| BeeProg2 | adaptér/modul: BGA-2324/0887 (70-2324/0887) = BGA-Bottom-140 (70-2324) + BGA-Top-155 ZIF (70-0887) |
| BeeProg2C | adaptér/modul: BGA-2324/0887 (70-2324/0887) = BGA-Bottom-140 (70-2324) + BGA-Top-155 ZIF (70-0887) |
| BeeProg3 | adaptér/modul: AP3 BGA144-4 PLD-2 (73-3872) |
