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Obvod: Am29F016D [R-TSOP48]

Výrobca: AMD

Popis čísla dielu pre toto zariadenie:

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Am AMD Products  
XXXX Family Signature 29BDS = 1.8V, simultaneous Read/Write, Burst Mode
29DS = 1.8V, simultaneous Read/Write
29PDS = 1.8V, simultaneous Read/Write, Pge mode
29SL = 1.8V Flash
29BDD = 2.5V, simultaneous Read/Write, Burst mode
29LV = 3V Flash
29DL = 3V, Simuiltaneous Read/Write
29BL = 3V, Burst mode
29PL = 3V, Page mode
29PDL = 3V, Simultaneous Read/Write, Page mode
30LV = 3V, Ultra NAND
29F = 5V Flash
XXX Density, Bus Width and Sector Organization 001, 010 = 128kx8
002 = 256kx8
004, 040 = 512kx8
008, 080, 081 = 1Mx8
016, 017, 116 = 2Mx8
032, 033 = 4Mx8
065 = 8Mx8
100 = 64kx16
160 = 2Mx8 / 1Mx16
200 = 128kx16
320 = 4Mx8 / 2Mx16
400 = 256kx16
640, 641 = 4Mx16
800 = 1Mx8 / 512kx16
(X) Optional Parameter N = No RESET input
A = 5V-Only Program and Erase
X Process Technology B = 0.32 um technology
C = 0.32 um thin-film technology
D = 0.23 um thin-film technology
G = 0.17 um thin-film technology
M = MirrorBit technology
XX Sector Architecture and Sector Write Protection T = Top boot sector
B = Bottom boot sector
H = Uniform sector device, highest address sector protected
L = Uniform sector device, lowest address sector protected
U, Blank = Uniform sector device
J40 = (Ultra NAND only) 100\% usable blocks
XXX Speed Option, Voltage Regulation 1.8V devices:
xx(x) = (29SL,DS) indicates speed in ns, Vcc=1.8V to 2.2V
xA, xB = (29BDS) digits indicates asynchronous speed (5=55ns, 7=70ns, 9=90ns, 11=110ns),
letter represents burst mode speed and handshaking availability
(A=40MHz, B=54MHz), Vcc=1.7V to 1.9V
3V devices:
xx(x) = indicates speed in ns or MHz, device is full voltage range, Vcc=2.7V to 3.6V
xx(x)R = 2 or 3 digits indicate speed in ns, „R“ indicates regulated voltage range Vcc=3.0V to 3.6V
x(x)1(R) = (29LV64X) first two digits indicate speed in nsx10. „1“ indicates Vio < Vcc, „R“, if present indicat
regulated voltage range
5V devices:
x(x)0 = speed option ends in „0“: indicates speed in ns., Vcc=5V +/- 10\\%
x5 = speed option ends in „5“: indicates speed in ns
X Package Type P = Plastic DIL
J = Plastic LCC
S = SOP
Z = SSOP
E = TSOP
E2 = TSOP II
F = reverse TSOP
F2 = reverse TSOP II
K = 80-pin PQFP
0.8mm ball pitch (unless otherwise noted):
MA = 63-ball FBGA (11x12mm)
VA = 44-ball FBGA (9.2x8mm, 0.5mm pitch)
VR = 48-ball, VFBGA (8.15x6.15mm)
WA = 48-ball FBGA (6x8mm)
WB = 48-ball, FBGA (6x9mm)
WC = 48-ball, FBGA (8x9mm)
WD = 63-ball, FBGA (8x14mm)
WG = 40-ball, FBGA (8x15mm)
WH = 63-ball, FBGA (12x11mm)
WK = 47-ball, FBGA (7x10mm, 0.5mm pitch)
WL = 48-ball, (11x10mm, 0.5mm pitch)
WM = 48-ball, (6x12mm)
WN = 84-ball, FBGA(11x12mm)
WP = 84-ball, FBGA(FBF084)
1.0mm ball pitch (unless othervise noted):
PA = 64-ball, BGA (13x11mm, 1.7mm)
PB = 80-ball, BGA (13x11mm)
PC = 64-ball, BGA (13x11mm)
PE = 80-ball, BGA (10x15mm)
X Temperature Range C = Commercial (0°C to 70°C)
D = Commercial (0°C to 70°C) with Pb-free package
I = Industrial (-40°C to 85°C)
F = Industrial (-40°C to 85°C) with Pb-free package
V = Automotive in-cabin (-40°C to 105°C)
Y = Automotive in-cabin (-40°C to 105°C) with Pb-free package
E = Extended
X Optional Proccessing Blank = Standard Proccessing
N = ESN devices
B = Burn-in

Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.

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