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Obvod: 3DMR4M08VS4428 - NATASIA [SOP44]

Výrobca: 3D Plus

Popis čísla dielu pre toto zariadenie:

Nabehnutím kurzora zvýraznite konkrétnu sekciu
3D 3D Plus Module  
XX Module Type DP = DPRAM
EE = EEPROM
FN = Flash NAND
FO = Flash NOR
FR = FRAM
MR = MRAM
PO = PROM
SF = StrataFlash
SD = Synchronous RAM
SR = Static RAM
1D = DDR1
2D = DDR2
XXXX Module Density nnnK = nnn kilobit
nnnM = nnn Megabit
nnnG = nnn Gigabit
nnnT = nnn Terabit
XX Module Data Bit 04 = x4 bit
08 = x8 bit
16 = x16 bit
32 = x32 bit
40 = x40 bit
48 = x48 bit
64 = x64 bit
nn = xnn bit
X Module Voltage C = 5.0 V
V = 3.3V
S = 2.8V
T = 2.5V
U = 1.8V
X Module Package B = BGA
C = Connector
J = QFJ
P = PGA
Q = QFP
S = SOP
W = Wire Bond
X Stacked Layers 1 = 1 layer
2 = 2 layers
4 = 4 layers
8 = 8 layers
n = n layers
A = 10 layers
XXX Control Features / Flayer Reference nnn = Product flayer number
X Temperature Range C = 0°C to 70°C
I = -40°C to 85°C
M = -55°C to 125°C
S = Specific
X Quality Level N = Commercial grade
B = Industrial grade
S = Space grade
C = Custom
X Space Screening Option Blank = ESA qualified (quality grade for space applications ECSS-Q-60-05C)
P = NASA PEM selection (screening and qualification PEM-INST-001)
X Radiation Assurance R = Radiation data tested
A = Generic radiation data available
- = Not applicable
XX Speed / Access Time 00 = N/A
SRAM
10 = 10 ns
12 = 12 ns
15 = 15 ns
20 = 20 ns
MRAM
35 = 35 ns
FRAM
60 = 60 ns
SDRAM
50 = 5 ns
55 = 5.5 ns
60 = 6 ns
70 = 7 ns
75 = 7.5 ns
80 = 8 ns
DDR
- first digit:
5 = 500 MHz
6 = 166 MHz
7 = 133 MHz
8 = 100 MHz
- second digit:
C = CL = 3
B = CL = 2.5
A = CL = 2
DDR2
- first digit
4 = DDR2-400 (200 MHz)
5 = DDR2-533 (266 MHz)
6 = DDR2-667 (333 MHz)
8 = DDR2-800 (400 MHz)
- second digit:
A = CL = 3, tRCD = 3, tRP = 3
C = CL = 4, tRCD = 4, tRP = 4
E = CL = 5, tRCD = 5, tRP = 5
G = CL = 6, tRCD = 6, tRP = 6
FLASH
03 = 30 ns
05 = 50 ns
07 = 70 ns
08 = 80 ns
09 = 90 ns
10 = 100 ns
11 = 110 ns
12 = 120 ns
25 = 25 ns
35 = 35 ns
X Module Option Blank = No option
A = ARATHANE finish
E = EPOTEK 302-3M
H = Hermetic package
M = MAPSIL finish
T = Tantalum shielding
W = WALOPACK shieldeng
X = XV501T4 finish solder

Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.

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