Obvod: 3DFN32G08VS8467-GULLIVER [SOP50]
Výrobca: 3D Plus
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| 3D | 3D Plus Module | |
| XX | Module Type | DP = DPRAM EE = EEPROM FN = Flash NAND FO = Flash NOR FR = FRAM MR = MRAM PO = PROM SF = StrataFlash SD = Synchronous RAM SR = Static RAM 1D = DDR1 2D = DDR2 |
| XXXX | Module Density | nnnK = nnn kilobit nnnM = nnn Megabit nnnG = nnn Gigabit nnnT = nnn Terabit |
| XX | Module Data Bit | 04 = x4 bit 08 = x8 bit 16 = x16 bit 32 = x32 bit 40 = x40 bit 48 = x48 bit 64 = x64 bit nn = xnn bit |
| X | Module Voltage | C = 5.0 V V = 3.3V S = 2.8V T = 2.5V U = 1.8V |
| X | Module Package | B = BGA C = Connector J = QFJ P = PGA Q = QFP S = SOP W = Wire Bond |
| X | Stacked Layers | 1 = 1 layer 2 = 2 layers 4 = 4 layers 8 = 8 layers n = n layers A = 10 layers |
| XXX | Control Features / Flayer Reference | nnn = Product flayer number |
| X | Temperature Range | C = 0°C to 70°C I = -40°C to 85°C M = -55°C to 125°C S = Specific |
| X | Quality Level | N = Commercial grade B = Industrial grade S = Space grade C = Custom |
| X | Space Screening Option | Blank = ESA qualified (quality grade for space applications ECSS-Q-60-05C) P = NASA PEM selection (screening and qualification PEM-INST-001) |
| X | Radiation Assurance | R = Radiation data tested A = Generic radiation data available - = Not applicable |
| XX | Speed / Access Time | 00 = N/A SRAM 10 = 10 ns 12 = 12 ns 15 = 15 ns 20 = 20 ns MRAM 35 = 35 ns FRAM 60 = 60 ns SDRAM 50 = 5 ns 55 = 5.5 ns 60 = 6 ns 70 = 7 ns 75 = 7.5 ns 80 = 8 ns DDR - first digit: 5 = 500 MHz 6 = 166 MHz 7 = 133 MHz 8 = 100 MHz - second digit: C = CL = 3 B = CL = 2.5 A = CL = 2 DDR2 - first digit 4 = DDR2-400 (200 MHz) 5 = DDR2-533 (266 MHz) 6 = DDR2-667 (333 MHz) 8 = DDR2-800 (400 MHz) - second digit: A = CL = 3, tRCD = 3, tRP = 3 C = CL = 4, tRCD = 4, tRP = 4 E = CL = 5, tRCD = 5, tRP = 5 G = CL = 6, tRCD = 6, tRP = 6 FLASH 03 = 30 ns 05 = 50 ns 07 = 70 ns 08 = 80 ns 09 = 90 ns 10 = 100 ns 11 = 110 ns 12 = 120 ns 25 = 25 ns 35 = 35 ns |
| X | Module Option | Blank = No option A = ARATHANE finish E = EPOTEK 302-3M H = Hermetic package M = MAPSIL finish T = Tantalum shielding W = WALOPACK shieldeng X = XV501T4 finish solder |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375) |
| BeeHive204AP | adaptér/modul: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935) |
| BeeHive208S | adaptér/modul: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375) |
| BeeHive304 | adaptér/modul: AP3 TSOP50 module 3D Plus NAND-1a (73-3729A) |
| BeeProg2 | adaptér/modul: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375) |
| BeeProg2AP | adaptér/modul: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935) |
| BeeProg2C | adaptér/modul: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375) |
| BeeProg3 | adaptér/modul: AP3 TSOP50 module 3D Plus NAND-1a (73-3729A) |
| BeeHive204AP-AU (prestala byť podporovaná) | adaptér/modul: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935) |
