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| Ord. no. | 70-0600 |
|---|---|
| Socket | ZIF BGA100 OpenTop type |
| Bottom | 8+3 rows, 8x25+3x20 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock |
0 pcs.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here. |
Price: US $396.00 [read this!]
Price 2-3: US $376.20
Price 4-7: US $364.30
Price 8+ : Ask for price [?]
Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:
1. fixed discount when buying 4+ adapters of particular type,
2. individual discount for quantities 8+ according to type of adapter and demanded quantity. To get Quotation 8+ please click here:
Ask for price
We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-94 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Once fully actuated, drop the package into the socket from a height of 2 to 3mm above the seating plane.
- Do not push package while loading or releasing the lid.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- Check attached brochure for details on proper insertion procedure of chip/device into this ZIF socket.
- The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | 1 | 1.1 | 1.2 |
| Ball Height | A1 | 0.25 | 0.3 | 0.35 |
| Body Thickness | A2 | 0.55 | 0.6 | 0.65 |
| Ball Diameter | b | - | 0.4 | - |
| Body Size | D | 8.95 | 9 | 9.05 |
| Body Size | E | 8.95 | 9 | 9.05 |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 10 | - |
| Ball Array E | GE | - | 10 | - |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.1 |
| Ball Height | A1 | 0.25 | - | 0.35 |
| Body Thickness | A2 | - | 0.74 | - |
| Ball Diameter | b | 0.35 | - | 0.45 |
| Body Size | D | 8.95 | 9 | 9.05 |
| Body Size | E | 8.95 | 9 | 9.05 |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 10 | - |
| Ball Array E | GE | - | 10 | - |
