Price: US $484.00 [read this!]

Price 2-3: US $459.80

Price 4-7: US $445.30

Price 8+ : Ask for price [?]

Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:

    1. fixed discount when buying 4+ adapters of particular type,

    2. individual discount for quantities 8+ according to type of adapter and        demanded quantity. To get Quotation 8+ please click here: Ask for price

We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.

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Adapter manual

• For work with BGA device it is necessary put together BGA-Top-92 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
• The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
• Check this brochure (https://www.elnec.com/sw/3m_tweezer_handling.pdf) for details on proper insertion procedure of chip/device into this ZIF socket.
• Check attached brochure for details on proper insertion procedure of chip/device into this ZIF socket.
• Once fully actuated, drop the package into the socket from a height of 2 to 3mm above the seating plane and slightly press the device into ZIF socket.
• The chip fit into ZIF socket very precise, therefore it right happen, the chip be shuck a bit into ZIF socket. Therefore we recoment to use the vacuum pen with large rubber cup. The suitable vacuum pen is attached to the BGA-Top-92 ZIF adapter delivery.
• Do not push package while loading or releasing the lid.
• Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
• The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
• Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
• Notes to the BGA-Top-92 ZIF, S/N below 682-00008:
• - after putting chip into ZIF socket, slightly press on the top of it to ensure proper position of chip into ZIF socket.
• - use proper type of vacuum pen and enough big rubber cap (8mm diameter or above) for removing a chip from ZIF socket.

Software note

• If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.

Accepted package(s)

BGA package

Usable for programmer(s):