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Ord. no. | 70-0532 |
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Socket | ZIF BGA64 OpenTop type |
Bottom | 4 rows, 4x 25 pins, square, 0.6x0.6mm |
Class | BGA/LGA |
Subclass | BGA-Top |
Availability in stock |
0 pcs.
[ We are sorry, that the item is not in stock at the moment. Please ask for availability, click here. other 3 pcs. within 3 working days ]
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
Price: US $374.00 [read this!]
Price 2-3: US $355.30
Price 4-7: US $344.10
Price 8+ : Ask for price [?]
Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:
1. fixed discount when buying 4+ adapters of particular type,
2. individual discount for quantities 8+ according to type of adapter and demanded quantity. To get Quotation 8+ please click here:
Ask for price
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Adapter manual
- For work with BGA device it is necessary put together BGA-Top-84 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket.
- Once fully actuated, drop the package into the socket from a height of 2 to 3mm above the seating plane and slightly press the device into ZIF socket.
- Do not push package while loading or releasing the lid.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package | |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | 1.21 | - | 1.7 |
Ball Height | A1 | 0.27 | - | - |
Body Thickness | A2 | - | 1.12 | - |
Ball Diameter | b | 0.45 | 0.5 | 0.55 |
Body Size | D | 7.75 | 8 | 8.15 |
Body Size | E | 7.75 | 8 | 8.15 |
Ball Pitch | e | 0.72 | 0.8 | 0.88 |
Ball Array D | GD | - | 8 | - |
Ball Array E | GE | - | 8 | - |