|
|
Ord. no. | 70-2812 |
---|---|
Socket | ZIF BGA66, ClamShell type |
Bottom | 4x25 pins, square, 0.6x0.6mm |
Class | BGA/LGA |
Subclass | BGA-Top |
Availability in stock |
1 pcs.
[ other 1 pcs. within 3 working days ]
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
Move the cursor over the picture for additional view.
Ask for price
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-300 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package | |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | 0.52 | 0.57 | 0.62 |
Ball Height | A1 | 0.17 | 0.19 | 0.21 |
Body Thickness | A2 | 0.35 | 0.38 | 0.41 |
Ball Diameter | b | 0.24 | 0.27 | 0.3 |
Body Size | D | 3.986 | 4.006 | 4.026 |
Body Size | E | 3.654 | 3.674 | 3.694 |
Ball Pitch | e | - | 0.4 | - |
Ball Array D | GD | - | 9 | - |
Ball Array E | GE | - | 9 | - |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | 0.52 | 0.57 | 0.62 |
Ball Height | A1 | 0.17 | 0.19 | 0.21 |
Body Thickness | A2 | 0.35 | 0.38 | 0.41 |
Ball Diameter | b | 0.24 | 0.27 | 0.3 |
Body Size | D | 3.986 | 4.006 | 4.026 |
Body Size | E | 3.654 | 3.674 | 3.694 |
Ball Pitch | e | - | 0.4 | - |
Ball Array D | GD | - | 9 | - |
Ball Array E | GE | - | 9 | - |