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For work with BGA device it is necessary put together BGA-Top-266 ZIF-CS (a) with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
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