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| Ord. no. | 70-2177 |
|---|---|
| Socket | ZIF BGA676, OpenTop type |
| Bottom | 2x25 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock |
0 pcs.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here. |
Price: US $699.00 [read this!]
Price 2-3: US $664.10
Price 4-7: US $643.10
Price 8+ : Ask for price [?]
Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:
1. fixed discount when buying 4+ adapters of particular type,
2. individual discount for quantities 8+ according to type of adapter and demanded quantity. To get Quotation 8+ please click here:
Ask for price
We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-248 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Check attached brochure for details on proper insertion procedure of chip/device into this ZIF socket.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | 1.7 | 2.15 | 2.6 |
| Ball Height | A1 | 0.3 | 0.5 | 0.7 |
| Body Thickness | A2 | - | - | - |
| Ball Diameter | b | 0.5 | 0.6 | 0.7 |
| Body Size | D | - | 27 | - |
| Body Size | E | - | 27 | - |
| Ball Pitch | e | - | 1 | - |
| Ball Array D | GD | - | 26 | - |
| Ball Array E | GE | - | 26 | - |
