BGA-Top-23 ZIF-CS programming programmer adapter, socket converter - package BGA56

Exhibitions

IFAM Ljubljana 2025

11th - 13th Feb 2025
Exhibition and Convention Center
exhibitor: AX elektronika d.o.o.

--------------------------------

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top board of BGA adapters ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness. The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board. operating (mechanical) warranty of ZIF socket - 500,000 actuations made in Slovakia
Ord. no.	70-0311
Socket	ZIF BGA64 (depopulated array of (64) spring probes), ClamShell type
Bottom	4 rows, 4x 25 pins, square, 0.6x0.6mm
Class	BGA/LGA
Subclass	BGA-Top
Availability in stock	1 pcs. [ other 4 pcs. This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 working days ]

Price: US $655.00 [read this!]

Price 2-3: US $622.30

Price 4-7: US $602.60

Price 8+ : Ask for price [?]

Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:

1. fixed discount when buying 4+ adapters of particular type,

2. individual discount for quantities 8+ according to type of adapter and demanded quantity. To get Quotation 8+ please click here: Ask for price

We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.

Adapter manual

For work with BGA device it is necessary put together BGA-Top-23 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note

If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.

Accepted package(s)

BGA package

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	0.3	0.35
Body Thickness	A2	0.8	-	0.95
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.95	9	9.05
Body Size	E	6.95	7	7.05
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	0.3	0.35
Body Thickness	A2	0.61	0.66	0.71
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.9	9	9.1
Body Size	E	6.9	7	7.1
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.2	-	-
Body Thickness	A2	0.81	-	0.97
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	-	9	-
Body Size	E	-	7	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.25
Ball Height	A1	0.16	0.21	0.3
Body Thickness	A2	-	0.91	0.94
Ball Diameter	b	0.27	0.35	0.4
Body Size	D	8.9	9	9.1
Body Size	E	6.9	7	7.1
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1
Ball Height	A1	0.17	-	-
Body Thickness	A2	0.62	-	0.76
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	-	9	-
Body Size	E	-	7	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	-	0.22	-
Body Thickness	A2	-	-	0.97
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.95	9	9.05
Body Size	E	6.95	7	7.05
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.17	0.22	-
Body Thickness	A2	0.81	-	0.97
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.95	9	9.05
Body Size	E	6.95	7	7.05
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.17	-	-
Body Thickness	A2	0.81	-	0.97
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	-	9	-
Body Size	E	-	7	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	0.3	0.35
Body Thickness	A2	0.71	0.76	0.81
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.9	9	9.1
Body Size	E	6.9	7	7.1
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	1	1.1	1.2
Ball Height	A1	0.18	0.23	0.28
Body Thickness	A2	-	-	-
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.9	9	9.1
Body Size	E	6.9	7	7.1
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	1	1.1	1.2
Ball Height	A1	0.17	0.23	0.28
Body Thickness	A2	-	-	-
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.9	9	9.1
Body Size	E	6.9	7	7.1
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.4
Ball Height	A1	0.2	0.25	0.3
Body Thickness	A2	0.92	0.96	1.02
Ball Diameter	b	0.3	0.35	0.4
Body Size	D	8.9	9	9.1
Body Size	E	6.9	7	7.1
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.2	-	-
Body Thickness	A2	-	0.79	-
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.9	9	9.1
Body Size	E	6.9	7	7.1
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	0.3	0.35
Body Thickness	A2	0.65	-	-
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	8.9	9	9.1
Body Size	E	6.9	7	7.1
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	1.08	-	1.12
Ball Height	A1	0.31	-	0.33
Body Thickness	A2	0.76	-	0.8
Ball Diameter	b	0.36	-	0.4
Body Size	D	9	9	9.04
Body Size	E	7.01	7	7.04
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	8	-

Usable for programmer(s):

BeeHive208S BeeHive204 BeeProg2 BeeProg2C

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