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Ord. no. | 70-1379 |
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Socket | ZIF BGA100, ClamShell type |
Bottom | 8x25 + 3x20 pins, square, 0.6x0.6mm |
Class | BGA/LGA |
Subclass | BGA-Top |
Availability in stock |
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Adapter manual
- For work with BGA device it is necessary put together BGA-Top-232 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package | |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | - | - | 1 |
Ball Height | A1 | 0.22 | - | 0.32 |
Body Thickness | A2 | - | 0.66 | - |
Ball Diameter | b | 0.3 | - | 0.4 |
Body Size | D | 6.9 | 7 | 7.1 |
Body Size | E | 6.9 | 7 | 7.1 |
Ball Pitch | e | - | 0.65 | - |
Ball Array D | GD | - | 10 | - |
Ball Array E | GE | - | 10 | - |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | - | - | 1 |
Ball Height | A1 | 0.2 | - | - |
Body Thickness | A2 | 0.65 | - | - |
Ball Diameter | b | 0.3 | 0.35 | 0.4 |
Body Size | D | 6.9 | 7 | 7.1 |
Body Size | E | 6.9 | 7 | 7.1 |
Ball Pitch | e | - | 0.65 | - |
Ball Array D | GD | - | 10 | - |
Ball Array E | GE | - | 10 | - |