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| Ord. no. | 70-0288 |
|---|---|
| Socket | ZIF BGA64, ClamShell type |
| Bottom | 4 rows, 4x 25 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock |
0 pcs.
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Adapter manual
- For work with BGA device it is necessary put together BGA-Top-22 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1 |
| Ball Height | A1 | 0.15 | - | - |
| Body Thickness | A2 | - | 0.665 | - |
| Ball Diameter | b | 0.325 | 0.375 | 0.425 |
| Body Size | D | 7.6 | 7.7 | 7.8 |
| Body Size | E | 8.9 | 9 | 9.1 |
| Ball Pitch | e | - | 0.75 | - |
| Ball Array D | GD | - | 8 | - |
| Ball Array E | GE | - | 6 | - |
