For work with BGA device it is necessary put together BGA-Top-223 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane.
Do not push package while loading or releasing the lid.
Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
Check attached brochure for details on proper insertion procedure of chip/device into this ZIF socket.
The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
