|
|
| Ord. no. | 70-1164 |
|---|---|
| Socket | ZIF BGA64, ClamShell type |
| Bottom | 4x25 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock |
0 pcs.
[ We are sorry, that the item is not in stock at the moment. Please ask for availability, click here. other 2 pcs. within 3 working days ]
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
Move the cursor over the picture for additional view.
Ask for price
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-220 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | 0.535 | 0.585 | 0.635 |
| Ball Height | A1 | 0.205 | 0.23 | 0.255 |
| Body Thickness | A2 | 0.33 | 0.355 | 0.38 |
| Ball Diameter | b | 0.29 | 0.32 | 0.35 |
| Body Size | D | 4.446 | 4.466 | 4.486 |
| Body Size | E | 4.375 | 4.395 | 4.415 |
| Ball Pitch | e | - | 0.5 | - |
| Ball Array D | GD | - | 8 | - |
| Ball Array E | GE | - | 8 | - |
