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Ord. no. | 70-0287 |
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Socket | ZIF BGA48 (depopulated array of (48) spring probes), ClamShell type |
Bottom | 4 rows, 4x 25 pins, square, 0.6x0.6mm |
Class | BGA/LGA |
Subclass | BGA-Top |
Availability in stock |
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Adapter manual
- For work with BGA device it is necessary put together BGA-Top-21 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package | |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | - | - | 1 |
Ball Height | A1 | 0.15 | - | - |
Body Thickness | A2 | - | 0.665 | - |
Ball Diameter | b | 0.325 | 0.375 | 0.425 |
Body Size | D | 7.186 | 7.286 | 7.386 |
Body Size | E | 6.864 | 6.964 | 7.064 |
Ball Pitch | e | - | 0.75 | - |
Ball Array D | GD | - | 8 | - |
Ball Array E | GE | - | 6 | - |