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| Ord. no. | 70-0816 |
|---|---|
| Socket | ZIF BGA63, OpenTop type |
| Bottom | 4x25 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock |
0 pcs.
[ We are sorry, that the item is not in stock at the moment. Please ask for availability, click here. other 5 pcs. within 3 working days ]
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
Price: US $385.00 [read this!]
Price 2-3: US $365.80
Price 4-7: US $354.20
Price 8+ : Ask for price [?]
Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:
1. fixed discount when buying 4+ adapters of particular type,
2. individual discount for quantities 8+ according to type of adapter and demanded quantity. To get Quotation 8+ please click here:
Ask for price
We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-151 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF and BGA-Bottom-X boards to have complete BGA adapter
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.2 |
| Ball Height | A1 | 0.2 | - | - |
| Body Thickness | A2 | 0.84 | - | 0.94 |
| Ball Diameter | b | 0.25 | 0.3 | 0.35 |
| Body Size | D | - | 14 | - |
| Body Size | E | - | 8 | - |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 12 | - |
| Ball Array E | GE | - | 8 | - |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | 0.95 | 1.05 | 1.2 |
| Ball Height | A1 | 0.26 | 0.36 | 0.46 |
| Body Thickness | A2 | - | - | - |
| Ball Diameter | b | 0.4 | 0.45 | 0.5 |
| Body Size | D | 13.9 | 13.95 | 14 |
| Body Size | E | 7.9 | 7.95 | 8 |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 12 | - |
| Ball Array E | GE | - | 8 | - |
