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| Ord. no. | 70-3039 |
|---|---|
| Socket | ZIF BGA196, ClamShell type |
| Bottom | 8x25 + 3x20 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock |
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Adapter manual
- For work with BGA device it is necessary put together BGA-Top-136 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 2.05 |
| Ball Height | A1 | 0.4 | - | 0.6 |
| Body Thickness | A2 | - | - | - |
| Ball Diameter | b | 0.5 | - | 0.7 |
| Body Size | D | 14.8 | 15 | 15.2 |
| Body Size | E | 14.8 | 15 | 15.2 |
| Ball Pitch | e | - | 1 | - |
| Ball Array D | GD | - | 14 | - |
| Ball Array E | GE | - | 14 | - |
