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| Ord. no. | 70-0746 |
|---|---|
| Socket | ZIF BGA169, OpenTop type |
| Bottom | 8x25 + 3x20 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock |
0 pcs.
[ We are sorry, that the item is not in stock at the moment. Please ask for availability, click here. other 30 pcs. within 3 working days ]
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
Price: US $399.00 [read this!]
Price 2-3: US $379.10
Price 4-7: US $367.10
Price 8+ : Ask for price [?]
Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:
1. fixed discount when buying 4+ adapters of particular type,
2. individual discount for quantities 8+ according to type of adapter and demanded quantity. To get Quotation 8+ please click here:
Ask for price
We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-115 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket.
- Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane.
- Do not push package while loading or releasing the lid.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- Check attached brochure for details on proper insertion procedure of chip/device into this ZIF socket.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.2 |
| Ball Height | A1 | 0.2 | - | - |
| Body Thickness | A2 | 0.65 | - | - |
| Ball Diameter | b | 0.4 | 0.45 | 0.5 |
| Body Size | D | - | 12 | - |
| Body Size | E | - | 12 | - |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 13 | - |
| Ball Array E | GE | - | 13 | - |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.2 |
| Ball Height | A1 | 0.25 | - | - |
| Body Thickness | A2 | 0.55 | - | - |
| Ball Diameter | b | 0.35 | 0.4 | 0.45 |
| Body Size | D | - | 12 | - |
| Body Size | E | - | 12 | - |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 13 | - |
| Ball Array E | GE | - | 13 | - |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.2 |
| Ball Height | A1 | 0.24 | - | 0.36 |
| Body Thickness | A2 | 0.74 | - | 0.84 |
| Ball Diameter | b | 0.43 | - | 0.53 |
| Body Size | D | 11.8 | 12 | 12.2 |
| Body Size | E | 11.8 | 12 | 12.2 |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 13 | - |
| Ball Array E | GE | - | 13 | - |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.4 |
| Ball Height | A1 | 0.35 | - | 0.45 |
| Body Thickness | A2 | - | 0.9 | - |
| Ball Diameter | b | 0.45 | - | 0.55 |
| Body Size | D | 11.9 | 12 | 12.1 |
| Body Size | E | 11.9 | 12 | 12.1 |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 13 | - |
| Ball Array E | GE | - | 13 | - |
