Universal & Production Device Programmers, Adapters | Elnec
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  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) warranty of ZIF socket - 500,000 actuations
  • made in Slovakia
Ord. no. 70-0625
Socket ZIF BGA64 (depopulated array of (48) spring probes), Clamshell type
Bottom 4x25 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Availability in stock
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Adapter manual

  • For work with BGA device it is necessary put together BGA-Top-112 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Help for BGA-Top-112 ZIF-CS, 70-0625

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.7
Ball HeightA10.35--
Body ThicknessA21.15-1.25
Ball Diameterb0.40.450.5
Body SizeD-11.95-
Body SizeE-10.95-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.25--
Body ThicknessA21-1.1
Ball Diameterb0.30.350.4
Body SizeD-11.95-
Body SizeE-10.95-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-8-

Usable for programmer(s):

BeeHive208S BeeHive204 BeeProg2 BeeProg2C
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