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BGA-Bottom-300 (Ord. no. 70-2941)
See:
Adapter manual
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Accepted package(s)
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Usable for programmer(s)
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List of supported devices
Discontinued product! Please go to discontinued products section to find the replacement.
bottom board of BGA adapter, assigned for STMicroelectronics STM32F4xx and STM32F7xx devices in TFBGA216 package supported from PG4UW software version 3.25p made in Slovakia
Ord. no.
70-2941
Socket
8x25 + 3x20 sockets for wire wrap pin
Bottom
2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class
BGA/LGA
Subclass
BGA-Bottom
Adapter manual
Protect the contacts of adapter connectors from contamination. Any dirt and/or fat on contacts may cause errors during programming.
For work with BGA device it is necessary put together BGA-Bottom-X with some BGA-Top-X board according to the information provided by PG4UW software.
The picture shows, how to put together the BGA-Bottom-X and BGA-Top-X board to have complete BGA adapter.
Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.
Software note
If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.