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| Ord. no. | 70-2633 |
|---|---|
| Socket | 8x25 + 3x20 sockets for wire wrap pin |
| Bottom | 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil |
| Class | BGA/LGA |
| Subclass | BGA-Bottom |
| Availability in stock |
0 pcs.
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Adapter manual
- For work with BGA device it is necessary put together BGA-Bottom-267 with some BGA-Top-X ZIF-CS board according the information provided by PG4UW software.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
