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| Ord. no. | 71-7017 |
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| Socket | ZIF QFP100, OpenTop type |
| Bottom | 2 female connectors by 32 pins, DIN41612 B/2 |
| Class | Specialized |
| Subclass | TI (TMS) MCU |
| Availability in stock |
10 pcs. within 3 working days
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
Unit pricing strongly depends on quantity:
Price 1 pc : US $1506.00
Price 2 pcs: US $955.50
Price 3 pcs: US $779.50
show morePrice 4 pcs: US $678.00
Price 5 pcs: US $625.20
Price 6 pcs: US $590.00
Price 7 pcs: US $564.90
Price 8+ : Ask for price
Module manual
- Programmer don`t need to be switched off and SW can be running during inserting/removing programming module
- Protect the contacts of module connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
- Proceed with care! Incorrect insertion of device in module ZIF socket may lead to programmed device damage.
- Unscrew 2 knurled thumb screws. Insert programming module into Programming Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programming Module Interface connectors is possible. Screw 2 knurled thumb screws to fix programming module to programmer.
- Push the cover of module ZIF socket (the topmost movable part) to open the socket. Insert the device into module ZIF socket. Correct position of programmed device in module ZIF socket is indicated by picture near (usually on left above) the module ZIF socket. On that picture, reference corner of device (e.g. position of pin 1) is indicated by dot, by number 1, by bevelled corner or by any combination of mentioned. Then release module ZIF socket.
- The cover must be fully actuated (depressed) before inserting a device into the socket. If device is inserted into only partially opened ZIF socket, then - after releasing of cover – device pins might get damaged.
- Do not press on device while inserting it and/or releasing the cover.
- Visually check the placement of programmed device in module ZIF socket. If everything looks OK, the device is ready for programming.
- To take out the device from module, push the cover of module ZIF socket and remove the device.
- When you finish the work with module, unscrew 2 knurled thumb screws and remove the module from Programming Module Interface connectors.
- Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| LQFP100 |
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