Universal & Production Device Programmers, Adapters | Elnec
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Discontinued product! Please go to discontinued products section to find the replacement.

  • specialized programming module assigned for Serial Flash devices in BGA24 package (Serial Flash from Atmel, Micron, Spansion, Winbond ...)
  • operating (mechanical) warranty of ZIF socket - 20,000 actuations at room temperature.
  • made in Slovakia
Ord. no. 71-2762LD
Socket ZIF BGA25, OpenTop type
Bottom 2 female connectors, 32 pin, DIN41612 B/2
Class Specialized
Subclass BGA modules
AP1 BGA-1114/1197 (LD), 71-2762LD

Module manual

  • Unscrew 2 knurled thumb screws. Properly insert programming module to the Programming Module Interface. Due to connectors shape, only one orientation and position programming module in Programming Module Interface is possible. Screw 2 knurled thumb screws to fix programming module to programmer.
  • Push the top of programming module ZIF socket to open it. Insert the device into them. The right position of the programmed device in programming module ZIF socket is show at picture near (mainly left above) the programming module ZIF socket. Then release programming module ZIF socket.
  • Visually check interconnection between device and programming module ZIF socket. If everything looks OK, the device is ready for programming.
  • Be careful, because the incorrect insertion of programming module to the Programming Module Interface or device to the programming module ZIF socket can damage the programmed device.
  • To take out the device push the top of programming module ZIF socket and remove device from it.
  • When you finish work with programming module, remove it from the Programming Module Interface.
  • Do not directly touch the pins of Programming Module Interface and programming module ZIF socket, because dirt may cause errors during programming of device.
  • For handling with the device we recommended to use a vacuum pick up tool.

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb-0.4-
Body SizeD7.988.1
Body SizeE5.966.1
Ball Pitche-1-
Ball Array DGD-5-
Ball Array EGE-5-
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.2--
Body ThicknessA20.7-0.9
Ball Diameterb0.350.40.45
Body SizeD-8-
Body SizeE-6-
Ball Pitche-1-
Ball Array DGD-5-
Ball Array EGE-5-
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.2--
Body ThicknessA2-0.79-
Ball Diameterb0.350.40.45
Body SizeD7.988.1
Body SizeE5.966.1
Ball Pitche-1-
Ball Array DGD-5-
Ball Array EGE-5-

Usable for programmer(s):

BeeHive204AP BeeHive204AP-AU BeeProg2AP
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