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Device: X2816C [SOIC24]

Manufacturer: Xicor

Part number description for this device:

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X Xicor  
XX Family Descriptor 28 = EEPROM
X Technology Blank = NMOS
C = CMOS
HC = High perfomance CMOS
LV = Low-voltage CMOS
TC = Fast Column Access EEPROM
VC = Byte Alterable EEPROM
XXX Density 04A = 512x8
16A, 16B, 16C = 2kx8
010 = 128kx8
64, 64A, 64B, 64H = 8kx8
256 = 32kx8
512 = 64kx8
XX Temperature Range Blank = Commercial
I = Industrial
M = Military
MHR = Military high rel. processing
MB = MIL-STD-883
X Package Type P = Plastic DIP
J = PLCC
D = CerDIP
E = Ceramic LCC
S = SOIC
F = Flat Pack
K = Pin Grid Array
R = Ceramic SOIC
N = Stretched Ceramic LCC
T = TSOP
L = TQFP
XX Access Time Blank = 300 ns
25 = 250 ns
20 = 200 ns
15 = 150 ns
90 = 90 ns
70 = 70 ns
55 = 55 ns
45 = 45 ns
35 = 35 ns
XX Option T1 = Tape&Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL24W/SOIC24 ZIF 300mil (70-0878)
BeeHive204AP adapter/module: AP1 SOIC24 ZIF 300mil (71-1844)
BeeHive208S adapter/module: DIL24W/SOIC24 ZIF 300mil (70-0878)
BeeProg2 adapter/module: DIL24W/SOIC24 ZIF 300mil (70-0878)
BeeProg2AP adapter/module: AP1 SOIC24 ZIF 300mil (71-1844)
BeeProg2C adapter/module: DIL24W/SOIC24 ZIF 300mil (70-0878)
BeeHive204AP-AU (discontinued) adapter/module: AP1 SOIC24 ZIF 300mil (71-1844)
MEMprog2 (discontinued) adapter/module: DIL24W/SOIC24 ZIF 300mil (70-0878)
SmartProg2 (discontinued) adapter/module: DIL24W/SOIC24 ZIF 300mil (70-0878)
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