Device: W71NW20GF3FW [VFBGA162]
Manufacturer: Winbond
Part number description for this device:
Move the cursor over the box to highlight particular section| X | Winbond Standard Product | W = Winbond |
| XXX | Product Family | 71 = MCP product |
| XX | Voltage | NW = 1.8V ONFI NAND flash |
| X | Product Density | 1 = 1Gbit 2 = 2Gbit |
| X | NAND I/O bits | 08bit 1 = 16bit |
| X | Flash Generation | G = WEC 4X technology node H = WEC 4Xs technology node |
| X | RAM density | C = 512Mbit LPDDR D = 1Gbit LPDDR F = 1Gbit LPDDR2 |
| X | RAM Option Information | 1 = 4X technology x16 3 = 4X technology x32 |
| X | Package Type | D = 130 balls VFBGA E = 121 balls VFBGA F = 162 balls VFBGA |
| X | Grate & Temperature Range | W = Industrial (-40°C to 85°C) |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/BGA162-2 ZIF NAND-1 (70-3276) |
| BeeHive204AP | adapter/module: AP1 BGA162-2 ZIF NAND-1 (71-4239) |
| BeeHive208S | adapter/module: DIL48/BGA162-2 ZIF NAND-1 (70-3276) |
| BeeHive304 | adapter/module: AP3 BGA162-2.10 NAND-1 (73-4891) |
| BeeProg2 | adapter/module: DIL48/BGA162-2 ZIF NAND-1 (70-3276) |
| BeeProg2AP | adapter/module: AP1 BGA162-2 ZIF NAND-1 (71-4239) |
| BeeProg2C | adapter/module: DIL48/BGA162-2 ZIF NAND-1 (70-3276) |
| BeeProg3 | adapter/module: AP3 BGA162-2.10 NAND-1 (73-4891) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA162-2 ZIF NAND-1 (71-4239) |
