Device: W25X16BV [WSON8]
Manufacturer: Winbond
Part number description for this device:
Move the cursor over the box to highlight particular section| W | Winbond | |
| XXX | Family Descriptor | 25P = spiFlash serial flash memory 25Q = spiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O 25X, 25D = spiFlash serial flash memory with 4kB sectors, dual outputs 25B = spiFlash serial flash memory with boot and parameter sectors |
| XXX | Density | 10, 10A, 10B, 10C, 10R = 1Mbit 20, 20A, 20B, 20C, 20R, 21E = 2Mbit 40, 40A, 40B, 40C, 40R = 4Mbit 80, 80A, 80B, 80D, 81D = 8Mbit 16, 16A, 16B, 16C, 16D, 16J = 16Mbit 32, 32A, 32B, 32D, 32F = 32Mbit 64, 64B, 64C, 64D, 64F = 64Mbit 128B, 128F, 12P = 128Mbit 256F, 257F = 256Mbit 512J = 512Mbit 01J = 1Gbit 02J = 2Gbit |
| X | Supply Voltage | L = 2.3V to 3.3V V = 2.7V to 3.6V W = 1.65V to 1.95V |
| XX | Package Type | DA = PDIP8 300mil SN = SOIC8 150mil SS = SOIC8 200mil SF = SOIC16 300mil ZP = WSON8 6x5mm ZE = WSON8 8x6mm UU = USON8 4x3mm UX = 8-pad USON 2x3mm B = TFBGA24 8x6mm (5x5 ball array) (W25Q128FV) C = TFBGA24 8x6mm (6x4 ball array) (W25Q128/256FV) E = WSON8 8x6mm (W25Q128/256FV) F = SOIC16 300mil (W25Q128/256FV) P = WSON8 6x5mm (W25Q128FV) S = SOIC8 200mil (W25Q128FV) SV = VSOP8 150mil ST, T = VSOP8 208mil TB = 24-ball TFBGA 8x6mm (5x5-1 ball array) TC = 24-ball TFBGA 8x6mm (6x4 ball array) BY = 8-ball WLCSP XH = 8-pad XSON 2x3 |
| X | Temperature Range | C = Commercial (0°C to 70°C) I = Industrial (-40°C to 85°C) A = Automotive Grade 2 (-40°C to +105°C) J = Industrial Plus (-40°C to +105°C) S |
| X | Special Options | Blank = Standard G = Green package (Lead-free, RoHS compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb203) Z = Lead free (Lead-free, RoHS compliant) 1 = One time program (OTP) enabled P = Green Package with Status Register Power-Down & OTP enabled Q = Green Package with QE=1 in Status Register-2 M = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free SB2O3) & optimized for mobile applications N = Green Package with QE=1 in Status register-2 & DRV=75\\\\% E = Green Package with Extended Pad F = Green Package with QE=0 in Status Register-2 & SFDP |
| XXX | Transfer Rate | Blank = Single transfer rate DTR = Double transfer rate |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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