Device: TYCD0A211486KC [TFBGA137]
Manufacturer: Toshiba
Part number description for this device:
Move the cursor over the box to highlight particular section| T | Toshiba Products | |
| X | Supply Voltage | Y = 1.8V V = 3.0V |
| X | Density of RAM(SDRAM/PSRAM) | 0No die 9 = 512Mbit (2e+9) A = 1Gbit (2e+10) C = 4Gbit (2e+12) |
| X | Density of Flash(PureNAND/OneNAND/NOR) | 0No die A = 1Gbit (2e+10) B = 2Gbit (2x+11) C = 4Gbit (2e+12) D = 8Gbit (2e+13) |
| X | Density of Storage GB-NAND(eSD/mLBA/eMMC) | 0No die D = 1GByte (2e+13 = 8Gbit) E = 2GByte (2e+14 = 16Gbit) |
| X | Configuration | A = SDRAM + PureNAND B = SDRAM + OneNAND C = SDRAM + mLBA D = SDRAM + PureNAND + eSD F = SDRAM + PureNAND + eMMC H = SDRAM + eMMC 1 = PSRAM + NOR 0Others |
| X | RAM Die Number | 0No die 1 = 1 die 2 = 2 dies |
| X | Flash & Storage GB-NAND Die Number | 0No die 1 = 1 die 2 = 2 dies |
| XXXX | MCP Development Serial Number | |
| X | Package & Solder Ball Composition | K = Halogen free & 3.5Ag ball L = Halogen free & 1.0Ag ball |
| X | Package Height | 8 = 0.8mm 9 = 0.9mm A = 1.0mm C = 1.2mm |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeHive208S | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeProg2 | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeProg2C | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
