Move the cursor over the box to highlight particular section
TH
Toshiba Hybrid IC
X
Type Of Flash
X
Voltage Type
B = Vcc=3.3V, VccQ=3.3V or 1.8V
X
NAND Interface
M = e-MMC type
X
Controller Revision
XX
Memory Density
G6 = 64Gbit
X
NAND Cell Level
C = 4LC
X
Number Of Stacked NAND Chip/Package
X
NAND Design Rule
L = 15nm
XX
Package Type
BA = BGA
X
Temperature Range
I = -25°C to 85°C
X
Package Size
L = 11.5x13x.0.8mm
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
