Device: TMS27C291
Manufacturer: TI (TMS)
Part number description for this device:
Move the cursor over the box to highlight particular section| XXX | Device Type | TMS = Commercial MOS SMJ = Military MOS TMX = Pre-production Commercial MOS |
| XX | Family Descriptor | 25 = EPROM 27 = EPROM / OTP 28 = 12V Flash EEPROM |
| X | Erasibility | P = Non-erasable (OTP) Blank = Erasable |
| X | Technology | C = CMOS F = CMOS Flash EEPROM L = 10\\% Power Supply Tolerance LV = Low Voltage |
| XXX | Density | 08 = 1kx8 010, 010A = 128kx8 16 = 2kx8 020 = 256kx8 32 = 4kx8 040 = 512kx8 64 = 8kx8 110 = 32kx16 128 = 16kx8 210A = 64kx16 240 = 256kx16 256 = 32kx8 257 = 32kx8 291 = 2kx8 292 = 2kx8 400 = 512kx8 / 256kx16 510 = 64kx8 512 = 64kx8 |
| XX | Speed Option | 8, 80 = 80 ns 10, 100 = 100 ns 12, 120 = 120 ns 1, 15, 150 = 150 ns 1, 17, 170 = 170 ns 2, 20, 200 = 200 ns Blank, 25, 250 = 250 ns 30, 300 = 300 ns |
| XX | Package Type | DD = Plastic TSOP DU = Reverse Plastic TSOP FM = Rectangular PLCC FN = Square PLCC J = Ceramic DIP N = Plastic DIP PM = SQFP |
| X | Temperature Range | L = 0°C to 70°C E = -40°C to 85°C Q = -40°C to 125°C T = -40°C to 110°C M = -55°C to 125°C |
| X | 168 hour Burn-In Option | 4 = 168 hour Burn-In Blank = No Burn-In - for Military Blank = 5004 Processing |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | |
| BeeHive208S | |
| BeeHive304 | adapter/module: AP3 DIL48 (73-3319) |
| BeeProg2 | |
| BeeProg2C | |
| BeeProg3 | adapter/module: AP3 DIL48 (73-3319) |
| MEMprog2 (discontinued) | |
| SmartProg2 (discontinued) |
