Device: MSP430G2231
Manufacturer: TI (TMS)
Part number description for this device:
Move the cursor over the box to highlight particular sectionMSP | Processor Family | CC = Embedded RF radio MSP = Mixed signal processor XMS = Experimental silicon |
XXX | MCU Platform | 430 = TI's low power microcontroller platform |
X | Device Type | Memory type: C = ROM F = Flash FR = FRAM G = Flash (Value line) L = No nonvolatile memory Specialized application: AFE = Analog front end BT = Preprogrammed with bluetooth BQ = Contactless power CG = ROM medical FE = Flash energy meter FG = Flash medical FW = Flash electronic flow meter |
X | Series | 1 series = Up to 8MHz 2 series = Up to 16MHz 3 series = Legacy 4 series = Up to 16MHz w/ LCD 5 series = Up to 25MHz 6 series = Up to 25MHz w/ LCD 0Low voltage series |
XXX | Feature Set | various levels of integration within a series |
X | Revision | N/A |
X | Temperature Range | S = 0°C to 50°C C = 0°C to 70°C I = -40°C to 85°C T = -40°C to 105°C |
XXX | Packaging | www.ti.com/packaging |
X | Tape And Reel | T = Small reel (7 inch) R = Large reel (11 inch) No markings = Tube or Tray |
XX | Additional Features | EP = Enhanced product (-40°C to 105°C) HT = Extreme temperature (-55°C to 150°C) |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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