Device: S71WS256NC0BFxA [FBGA84]
Manufacturer: Spansion
Part number description for this device:
Move the cursor over the box to highlight particular section| S | Spansion Memory | |
| XX | Product Series | 71 = Multi-chip product (MCP) 73 = Stacked products (MCP) 98 = Stacked Multi-chip product |
| X | Flash Interface And Simultaneous Read-Write | J = Standard, simultaneous read-write A = Standard, no simultaneous read-write P = Page, simultaneous read-write G = Page, no simultaneous read-write W = Burst (Demux add/data), simultaneous read-write R = Burst (Demux add/data), no simultaneous read-write N = Burst (Mux add/data), simultaneous read-write K = Burst (Mux add/data), no simultaneous read-write C = Automotive burst (Demux), simultaneous read-write V = Simultaneous Read/Write, Burst mode with multiplexed I/O |
| X | Core Voltage | F = 5.0 V Vcc L = 3.0 V Vcc D = 2.5 V Vcc S = 1.8V Vcc |
| XXX | Density | 001-999 = 1Mb - 999Mb 01G-64G = 1Gb - 64Gb |
| X | Process Technology | B = 320 nm, Floating gate technology C = 320 nm, Floating gate technology D = 200 nm, Floating gate technology G = 170 nm, Floating gate technology H = 130 nm, Floating gate technology J = 110 nm, Floating gate technology M = 230 nm, MirrorBit technology A = 200 nm MirrorBit technology N = 110 nm, MirrorBit technology P = 90 nm, MirrorBit technology K = 90 nm, Floating gate technology R = 65 nm, MirrorBit technology |
| XX | pSRAM Density | 04 = 4Mbit SRAM 08 = 8Mbit SRAM 0A = 16Mbit pSRAM 40 = 4Mbit pSRAM 80 = 8Mbit pSRAM A0 = 16Mbit pSRAM B0 = 32Mbit pSRAM C0 = 64Mbit pSRAM D0 = 128Mbit pSRAM |
| XX | Package Type | B = FBGA C = CSOP (Lead Frame) D = Die (Die/Wafer) E = Super CSP (BGA) F = Fortified BGA M = SOIC/SOP (Lead Frame) N = WSON (Lead Frame) T = TSOP S = SOP H = MCP FBGA K = POP FBGA J = MCP FBGA ZJ = Very thin fine-pitch BGA lead-free LF35 package |
| X | Package Material Set | Blank A = Standard, not lead (Pb)-free F = Standard, lead (PB)-free |
| X | Temperature Range | Blank E = Engineering samples C = Commercial (0°C to 70°C) W = Wireless (-25°C to 85°C) I = Industrial (-40°C to 85°C) N = Extended (-40°C to 125°C) |
| X | Package Modifier | Blank 0, Q = 7x9mm, 1.2mm height, 56 balls 9 = 8x11.6mm, 1.2mm height, 64 balls T = 8x11.6mm, 1.4mm height, 84 balls A = 8x11.6mm, 1.2mm height, 84 balls E = 9x12mm, 1.2mm height, 84 balls Y = 9x12mm, 1.2mm height, 84 balls K = 7.7x6.2mm, 56-Ball |
| X | Model Number 1 | Blank H = CellularRAM type 2, DYB=1, PPB=0 S = CellularRAM type 2, DYB=1, PPB=1 T = CellularRAM type 3, DYB=1, PPB=1 4 = SDR DRAM x16, Type 5 |
| X | Model Number 2 | Blank V = 66MHz flash speed R = 80Mhz flash speed L = 108MHz flash speed |
| X | Packing Type | 0Tray 1 = Tube 2 = 7\\\'\\\' Tape & Reel 3 = 13\'\' Tape & Reel |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-0439/0446 (70-0439/0446) = BGA-Bottom-30 (70-0439) + BGA-Top-48 ZIF (70-0446) |
| BeeHive204AP | adapter/module: AP1 BGA-0439/0446 (71-2113) |
| BeeHive208S | adapter/module: BGA-0439/0446 (70-0439/0446) = BGA-Bottom-30 (70-0439) + BGA-Top-48 ZIF (70-0446) |
| BeeProg2 | adapter/module: BGA-0439/0446 (70-0439/0446) = BGA-Bottom-30 (70-0439) + BGA-Top-48 ZIF (70-0446) |
| BeeProg2AP | adapter/module: AP1 BGA-0439/0446 (71-2113) |
| BeeProg2C | adapter/module: BGA-0439/0446 (70-0439/0446) = BGA-Bottom-30 (70-0439) + BGA-Top-48 ZIF (70-0446) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA-0439/0446 (71-2113) |
