Device: S71VS256RC0AHKCL [FBGA56]
Manufacturer: Spansion
Part number description for this device:
Move the cursor over the box to highlight particular section| S | Spansion Memory | |
| XX | Product Series | 71 = Multi-chip product (MCP) 73 = Stacked products (MCP) 98 = Stacked Multi-chip product |
| X | Flash Interface And Simultaneous Read-Write | J = Standard, simultaneous read-write A = Standard, no simultaneous read-write P = Page, simultaneous read-write G = Page, no simultaneous read-write W = Burst (Demux add/data), simultaneous read-write R = Burst (Demux add/data), no simultaneous read-write N = Burst (Mux add/data), simultaneous read-write K = Burst (Mux add/data), no simultaneous read-write C = Automotive burst (Demux), simultaneous read-write V = Simultaneous Read/Write, Burst mode with multiplexed I/O X = Address-high, address-low, data multiplexed |
| X | Core Voltage | F = 5.0 V Vcc L = 3.0 V Vcc D = 2.5 V Vcc S = 1.8V Vcc |
| XXX | Density | 001-999 = 1Mb - 999Mb 01G-64G = 1Gb - 64Gb |
| X | Process Technology | B = 320 nm, Floating gate technology C = 320 nm, Floating gate technology D = 200 nm, Floating gate technology G = 170 nm, Floating gate technology H = 130 nm, Floating gate technology J = 110 nm, Floating gate technology M = 230 nm, MirrorBit technology A = 200 nm MirrorBit technology N = 110 nm, MirrorBit technology P = 90 nm, MirrorBit technology K = 90 nm, Floating gate technology R = 65 nm, MirrorBit technology |
| X | pSRAM Density | C = 64Mb |
| X | Chip Contents | 0No content (default) |
| XX | Package Type | ZH = Very thin fine-pitch ball grid array (VFBGA) |
| X | Package Modifier | K = 7.7 x 6.2, 56-ball BGA, 0.5mm ball pitch (0.3mm ball diameter) E = 9.2 x 8.0, 56-ball BGA, 0.5mm ball pitch (0.3mm ball diameter) |
| XX | Model Number | |
| X | Packing Type | 0Tray 2 = 7-inch Tape and Reel 3 = 13-inch Tape and Reel |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-0401/0605 (70-0401/0605) = BGA-Bottom-14 (70-0401) + BGA-Top-95 ZIF-CS (70-0605) |
| BeeHive204AP | adapter/module: AP1 BGA56-1.1 NOR-1 (71-3267) |
| BeeHive208S | adapter/module: BGA-0401/0605 (70-0401/0605) = BGA-Bottom-14 (70-0401) + BGA-Top-95 ZIF-CS (70-0605) |
| BeeHive304 | adapter/module: AP3 BGA56-1.1 NOR-1 (73-6286) |
| BeeProg2 | adapter/module: BGA-0401/0605 (70-0401/0605) = BGA-Bottom-14 (70-0401) + BGA-Top-95 ZIF-CS (70-0605) |
| BeeProg2AP | adapter/module: AP1 BGA56-1.1 NOR-1 (71-3267) |
| BeeProg2C | adapter/module: BGA-0401/0605 (70-0401/0605) = BGA-Bottom-14 (70-0401) + BGA-Top-95 ZIF-CS (70-0605) |
| BeeProg3 | adapter/module: AP3 BGA56-1.1 NOR-1 (73-6286) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA56-1.1 NOR-1 (71-3267) |
