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Device: S25FL256SxxMxxQ1 [SO16]

Manufacturer: Spansion

Part number description for this device:

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XXXX Device Family S25FL = Spansion Memory 3.0 Volt-Only, Serial Peripheral Interface
(SPI) Flash Memory
XXX Density 128 = 128Mbit
256 = 256Mbit
512 = 512Mbit
X Device Technology S = 0.065um MirrorBit Process Technology
XX Speed AG = 133MHz
DP = 66MHz DDR
X Package Type M = 16-pin SO package
N = 8-contact WSON 6x8mm package
B = 24-ball BGA 6x8mm package, 1.00mm pitch
X Package Materials F = Lead (Pb)-free
H = Low-Halogen, Lead (Pb)-free
X Temperature Range I = Industrial (–40°C to + 85°C)
V = Automotive In-Cabin (–40°C to + 105°C)
X Model Number (Security, Latency Type, Package Details, RESET# and V_IO Support) 0EHPLC, SO/WSON footprint
2 = EHPLC, 5 x 5 ball BGA footprint
3 = EHPLC, 4 x 6 ball BGA footprint
G = EHPLC, SO footprint with RESET#
R = EHPLC, SO footprint with RESET# and VIO
A = EHPLC, 5 x 5 ball BGA footprint with RESET# and VIO
B = EHPLC, 4 x 6 ball BGA footprint with RESET# and VIO
C = EHPLC, 5 x 5 ball BGA footprint with RESET#
D = EHPLC, 4 x 6 ball BGA footprint with RESET#
9 = HPLC, SO/WSON footprint
4 = HPLC, 5 x 5 ball BGA footprint
8 = HPLC, 4 x 6 ball BGA footprint
H = HPLC, SO footprint with RESET#
Q = HPLC, SO footprint with RESET# and VIO
7 = HPLC, 5 x 5 ball BGA footprint with RESET# and VIO
6 = HPLC, 4 x 6 ball BGA footprint with RESET# and VIO
E = HPLC, 5 x 5 ball BGA footprint with RESET#
F = HPLC, 4 x 6 ball BGA footprint with RESET#
K = Security, EHPLC, 5 x 5 ball BGA footprint with RESET# and VIO
L = Security, EHPLC, 4 x 6 ball BGA footprint with RESET# and VIO
S = Security, EHPLC, 5 x 5 ball BGA footprint with RESET#
T = Security, EHPLC, 4 x 6 ball BGA footprint with RESET#
Y = Security, EHPLC, 5 x 5 ball BGA footprint
Z = Security, EHPLC, 4 x 6 ball BGA footprint
M = Security, HPLC, 5 x 5 ball BGA footprint with RESET# and VIO
N = Security, HPLC, 4 x 6 ball BGA footprint with RESET# and VIO
U = Security, HPLC, 5 x 5 ball BGA footprint with RESET#
V = Security, HPLC, 4 x 6 ball BGA footprint with RESET#
W = Security, HPLC, 5 x 5 ball BGA footprint
X = Security, HPLC, 4 x 6 ball BGA footprint
X Model Number (Sector Type) 0Uniform 64-kB sectors
1 = Uniform 256-kB sectors
X Packing Type 0Tray
1 = Tube
3 = 13\'\' Trape and Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL16W/SOIC16 ZIF 300mil SFlash-1b (70-5488) OR DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A)
BeeHive204AP adapter/module: AP1 SOIC16 ZIF 300mil SFlash-1b (71-5489) OR AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096)
BeeHive208S adapter/module: DIL16W/SOIC16 ZIF 300mil SFlash-1b (70-5488) OR DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A)
BeeHive304 adapter/module: AP3 SOIC16-300 SFlash-1a (73-4441) OR AP3 SOIC16-300 SFlash-1 (discontinued)
BeeProg2 adapter/module: DIL16W/SOIC16 ZIF 300mil SFlash-1b (70-5488) OR DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A)
BeeProg2AP adapter/module: AP1 SOIC16 ZIF 300mil SFlash-1b (71-5489) OR AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096)
BeeProg2C adapter/module: DIL16W/SOIC16 ZIF 300mil SFlash-1b (70-5488) OR DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A)
BeeProg3 adapter/module: AP3 SOIC16-300 SFlash-1a (73-4441) OR AP3 SOIC16-300 SFlash-1 (discontinued)
BeeHive204AP-AU (discontinued) adapter/module: AP1 SOIC16 ZIF 300mil SFlash-1b (71-5489) OR AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096)
MEMprog2 (discontinued) adapter/module: DIL16W/SOIC16 ZIF 300mil (70-0881)
SmartProg2 (discontinued) adapter/module: DIL16W/SOIC16 ZIF 300mil (70-0881)
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