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Device: MBM29QM12DH60PCN [FBGA80]

Manufacturer: Spansion

Part number description for this device:

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MBM Spansion Memory - originally developed by Fujitsu
XX Product Series 29 = NOR Flash memory
X Device Type A = Conventional
B = Burst, dual operation, no handshake
D = Dual operation
F = Burst Dual operation, handshake
P = Page
Q = Page, Dual operation
R = Page, Dual operation, Multi CS
X = Page, Dual operation, x32
X Power Supply D = 2.5 V
E = 2.5 V, with Vccq
L = 3.0 V
M = 3.0 V, with Vccq
S = 1.8 V
T = 1.8 V, with Vccq
XX Density, I/O 32 = 32Mbit (4Mx8 / 2Mx16), Flexible bank
34 = 32Mbit (4Mx8 / 2Mx16), Sliding bank
64 = 64Mbit (8Mx8 / 4Mx16)
65 = 64Mbit (4Mx16)
96 = 96Mbit (6Mx16)
12 = 128Mbit (16Mx8 / 8Mx16 / 4Mx32)
X Sector Architecture T = Top boot
B = Bottom boot
D = Dual boot
L = Uniform sector, lowest sector protected
X Device Revision F = 170 nm technology
H = 130 nm technology
M = 230 nm MirrorBit technology
XX Speed Version 90 = 90 ns
10 = 100 ns
XXX Package Type PBT = FBGA
TN = TSOP 48
PCN = TSOP 56
PFV = SSOP
XXX Other Options  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0630/0265 (70-0630/0265) = BGA-Bottom-59 (70-0630) + BGA-Top-11 ZIF-CS (70-0265)
BeeHive208S adapter/module: BGA-0630/0265 (70-0630/0265) = BGA-Bottom-59 (70-0630) + BGA-Top-11 ZIF-CS (70-0265)
BeeProg2 adapter/module: BGA-0630/0265 (70-0630/0265) = BGA-Bottom-59 (70-0630) + BGA-Top-11 ZIF-CS (70-0265)
BeeProg2C adapter/module: BGA-0630/0265 (70-0630/0265) = BGA-Bottom-59 (70-0630) + BGA-Top-11 ZIF-CS (70-0265)
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