Device: Am29F002BB
Manufacturer: Spansion
Part number description for this device:
Move the cursor over the box to highlight particular section| Am | AMD Products | |
| XXXX | Family Signature | 29BDS = 1.8V, simultaneous Read/Write, Burst Mode 29DS = 1.8V, simultaneous Read/Write 29PDS = 1.8V, simultaneous Read/Write, Pge mode 29SL = 1.8V Flash 29BDD = 2.5V, simultaneous Read/Write, Burst mode 29LV = 3V Flash 29DL = 3V, Simuiltaneous Read/Write 29BL = 3V, Burst mode 29PL = 3V, Page mode 29PDL = 3V, Simultaneous Read/Write, Page mode 30LV = 3V, Ultra NAND 29F = 5V Flash |
| XXX | Density, Bus Width and Sector Organization | 001, 010 = 128kx8 002 = 256kx8 004, 040 = 512kx8 008, 080, 081 = 1Mx8 016, 017, 116 = 2Mx8 032, 033 = 4Mx8 065 = 8Mx8 100 = 64kx16 160 = 2Mx8 / 1Mx16 200 = 128kx16 320 = 4Mx8 / 2Mx16 400 = 256kx16 640, 641 = 4Mx16 800 = 1Mx8 / 512kx16 |
| (X) | Optional Parameter | N = No RESET input A = 5V-Only Program and Erase |
| X | Process Technology | B = 0.32 um technology C = 0.32 um thin-film technology D = 0.23 um thin-film technology G = 0.17 um thin-film technology M = MirrorBit technology |
| XX | Sector Architecture and Sector Write Protection | T = Top boot sector B = Bottom boot sector H = Uniform sector device, highest address sector protected L = Uniform sector device, lowest address sector protected U, Blank = Uniform sector device J40 = (Ultra NAND only) 100\% usable blocks |
| XXX | Speed Option, Voltage Regulation | 1.8V devices: xx(x) = (29SL,DS) indicates speed in ns, Vcc=1.8V to 2.2V xA, xB = (29BDS) digits indicates asynchronous speed (5=55ns, 7=70ns, 9=90ns, 11=110ns), letter represents burst mode speed and handshaking availability (A=40MHz, B=54MHz), Vcc=1.7V to 1.9V 3V devices: xx(x) = indicates speed in ns or MHz, device is full voltage range, Vcc=2.7V to 3.6V xx(x)R = 2 or 3 digits indicate speed in ns, „R“ indicates regulated voltage range Vcc=3.0V to 3.6V x(x)1(R) = (29LV64X) first two digits indicate speed in nsx10. „1“ indicates Vio < Vcc, „R“, if present indicat regulated voltage range 5V devices: x(x)0 = speed option ends in „0“: indicates speed in ns., Vcc=5V +/- 10\\% x5 = speed option ends in „5“: indicates speed in ns |
| X | Package Type | P = Plastic DIL J = Plastic LCC S = SOP Z = SSOP E = TSOP E2 = TSOP II F = reverse TSOP F2 = reverse TSOP II K = 80-pin PQFP 0.8mm ball pitch (unless otherwise noted): MA = 63-ball FBGA (11x12mm) VA = 44-ball FBGA (9.2x8mm, 0.5mm pitch) VR = 48-ball, VFBGA (8.15x6.15mm) WA = 48-ball FBGA (6x8mm) WB = 48-ball, FBGA (6x9mm) WC = 48-ball, FBGA (8x9mm) WD = 63-ball, FBGA (8x14mm) WG = 40-ball, FBGA (8x15mm) WH = 63-ball, FBGA (12x11mm) WK = 47-ball, FBGA (7x10mm, 0.5mm pitch) WL = 48-ball, (11x10mm, 0.5mm pitch) WM = 48-ball, (6x12mm) WN = 84-ball, FBGA(11x12mm) WP = 84-ball, FBGA(FBF084) 1.0mm ball pitch (unless othervise noted): PA = 64-ball, BGA (13x11mm, 1.7mm) PB = 80-ball, BGA (13x11mm) PC = 64-ball, BGA (13x11mm) PE = 80-ball, BGA (10x15mm) |
| X | Temperature Range | C = Commercial (0°C to 70°C) D = Commercial (0°C to 70°C) with Pb-free package I = Industrial (-40°C to 85°C) F = Industrial (-40°C to 85°C) with Pb-free package V = Automotive in-cabin (-40°C to 105°C) Y = Automotive in-cabin (-40°C to 105°C) with Pb-free package E = Extended |
| X | Optional Proccessing | Blank = Standard Proccessing N = ESN devices B = Burn-in |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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