Device: Am29DS323DTxxxWM [FBGA48]
Manufacturer: Spansion
Part number description for this device:
Move the cursor over the box to highlight particular section| Am | Spansion Memory | - originally developed by AMD |
| XX | Product Series | 29 = Sector erase NOR flash memory |
| XXX | Device Family | BDS = 1.8 V, Simultaneous Read-Write, Burst DS = 1.8 V Simultaneous Read-Write SL = 1.8 V LV = 3.0 V DL = 3.0 V, Simultaneous Read-Write BL = 3.0 V, Burst PL = 3.0 V, Page PDL = 3.0 V, Simultaneous Read-Write, Page F = 5.0 V |
| XXX | Density | |
| X | Process Technology | B = 320 nm Floating Gate C = 320 nm Floating Gate D = 230 nm Floating Gate G = 170 nm Floating Gate H = 130 nm Floating Gate M = 230 nm MirrorBit |
| X | Sector Architecture | U, Blank = Uniform sector T = Top boot sector B = Bottom boot sector H = Uniform sector, WP# protects highest addressed sector L = Uniform sector, WP# protects lowest addressed sector |
| XXX(R) | Speed Option | - "R" indicates regulated voltage range |
| XX | Package Type | J = PLCC K = PQFP P = Plastic DIP S = SOP SK = reverse SOP Z = SSOP E = TSOP E2 = TSOP-II F = reverse TSOP F2 = reverse TSOP-II MA = FBGA 63, 11 x 12 mm, 0.8 mm pitch MD = FBGA 63, 10.95 x 11.95 mm, 0.8 mm pitch VA = FBGA 44, 9.2 x 8 mm, 0.5 mm pitch VK = FBGA 80, 11.5 x 9 mm, 0.8 mm pitch VR = VFBGA 48, 8.15x6.15 mm, 0.8 mm pitch VM = FBGA 64, 8 x 9 mm, 0.8 mm pitch WA = FBGA 48, 6 x 8 mm, 0.8 mm pitch WB = FBGA 48, 6 x 9 mm, 0.8 mm pitch WC = FBGA 48, 8 x 9 mm, 0.8 mm pitch WD = FBGA 63, 8 x 14 mm, 0.8 mm pitch WG = FBGA 40, 8 x 15 mm, 0.8 mm pitch WH = FBGA 63, 12 x 11 mm, 0.8 mm pitch WK = FBGA 47, 7 x 10 mm, 0.5 mm pitch WL = FBGA 48, 11 x 10 mm, 0.5 mm pitch WM = FBGA 48, 6 x 12 mm, 0.8 mm pitch WP = FBGA 84, 11 x 12 mm, 0.8 mm pitch WS = FBGA 80, 11 x 12 mm, 0.8 mm pitch PA = FBGA 64, 13 x 11 mm, 1.0 mm pitch PB = FBGA 80, 13 x 11 mm, 1.0 mm pitch PC = FBGA 64, 13 x 11 mm, 1.0 mm pitch PE = FBGA 80, 10 x 15 mm, 1.0 mm pitch PG = FBGA 64, 18 x 12 mm, 1.0 mm pitch PH = FBGA 80, 13 x 11 mm, 1.0 mm pitch PI = FBGA 80, 11 x 12 mm, 1.0 mm pitch |
| X | Temperature Range | C = Commercial I = Industrial E = Extended |
| X | Optional Processing | Blank = Standard N = ESN device |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-0245/0614 (70-0245/0614) = BGA-Bottom-1 (70-0245) + BGA-Top-107 ZIF (70-0614) |
| BeeHive204AP | adapter/module: AP1 BGA-0245/0614 (71-2082) |
| BeeHive208S | adapter/module: BGA-0245/0614 (70-0245/0614) = BGA-Bottom-1 (70-0245) + BGA-Top-107 ZIF (70-0614) |
| BeeProg2 | adapter/module: BGA-0245/0614 (70-0245/0614) = BGA-Bottom-1 (70-0245) + BGA-Top-107 ZIF (70-0614) |
| BeeProg2AP | adapter/module: AP1 BGA-0245/0614 (71-2082) |
| BeeProg2C | adapter/module: BGA-0245/0614 (70-0245/0614) = BGA-Bottom-1 (70-0245) + BGA-Top-107 ZIF (70-0614) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA-0245/0614 (71-2082) |
